New Equipment | Surface Finish
Designed for wafer processing, Nordson MARCH's SPHERE™ series plasma systems, the StratoSPHERE offers superior plasma treatment for high-throughput advanced semiconductor packaging applications. The StratoSPHERE plasma system is ideal for wafer pro
Electronics Forum | Fri Oct 05 18:59:53 EDT 2001 | Dan Steffler
I have had an issue where solder has contaminated gold plated pads (fingers) where it is not acceptable. The pads must remain perfectly coplaniar for a LCD zebra strip to lay accross them. Does anyone know of a way to remove the marriage level of s
Electronics Forum | Mon Apr 01 20:10:24 EST 2002 | davef
Oh. [Howabout if I smack you?] If ahma connectin� wif whut yer sayin�, you: * Don�t like the appearance of the glue slobberin� out from under the component even though there is no apparent glue on solderable surfaces. * Concerned about the hydrosco
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
| https://www.eptac.com/faqs/ask-helena-leo/ask/dip-tinning-conductors-with-low-temperature-insulation-and-solder-pot-contamination
. Is there a concern with contamination of the solder pot by the melted insulation? Answer: Semi striping the wire with the slug still on the wire is an accepted practice in the industry
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
of the void relative to the soldered interfaces where fatigue cracks are expected to propagate (see Figure 2). Because the voiding is not always centered in the solder sphere or on the pads (see x-ray images), cross sectional images may not represent
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