New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
Technical Library | 2022-10-31 17:25:37.0
Mixed formulation solder alloys refer to specific combinations of Sn-37Pb and SAC305 (96.5Sn–3.0Ag–0.5Cu). They present a solution for the interim period before Pb-free electronic assemblies are universally accepted. In this work, the surfaces of mixed formulation solder alloys have been studied by in situ and real-time Auger electron spectroscopy as a function of temperature as the alloys are raised above the melting point. With increasing temperature, there is a growing fraction of low-level, bulk contaminants that segregate to the alloy surfaces. In particular, the amount of surface C is nearly _50–60 at. % C at the melting point. The segregating impurities inhibit solderability by providing a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. VC 2011 American Vacuum Society. [DOI: 10.1116/1.3584821]
Suppliers of Stencil/PCB Cleaners, Soldering Systems, Solder Paste Inspection & Measurement Systems, Ionic Contamination Test Systems, Spray Fluxers and Cleaning Chemicals
Parts & Supplies | Soldering - Wave
Titanium solder pot liner for a Vectra 450F solder pot. Converting your wave solder to Pb Free? Use a titanium solder pot liner to avoid the costly tin flush and risk of contamination. FOB: Origiin Contact: Assured Technical Service LLC AssuredT
Used SMT Equipment | Soldering Equipment/Fluxes
Versaflow Selective soldering Selective Soldering Process Advantages: Better, Faster, Cleaner & Cheaper! . consistent LF solder joint quality & significant reduction of DPM . No re-melting of top side SMD components, as with wave soldering . PCB
Used SMT Equipment | Soldering - Reflow
Perfect condition. 10 heating zones three cooling zones Power hood lifts RS-232 interface with PID microprocessorbased controller Combination belt and edge/rail conveyor Safety interlocks on electrical panels Over temp
The BEST Gold Contact Replating Kit includes the tools you need for fast replating and modification of circuit contacts. Edge contacts may require replating if they are contaminated with solder or become scratched during handling or do not meet the m
New Equipment | Selective Soldering
MB Manufacturing is proud to announce, we now offer Dedicated Solid Titanium Solder Nozzles for Seho and Pillar House Selective Solder machines. Our innovative designs allow even flow through a variety of apertures. We also offer shutters for fine fl
Salvage indispensible Ball Grid Arrays. Artek Manufacturing will: *Clean and Bake out all contaminants and moisture *Clean out all exsisting Solder *Replace solder spheres according to manufacture's specs *Bake out BGA prior to packing in MSD package
