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AQUANOX® A4625B - Aqueous Batch Cleaning Solution

AQUANOX® A4625B - Aqueous Batch Cleaning Solution

New Equipment | Cleaning Agents

AQUANOX® A4625B is an innovative aqueous chemistry designed for optimum effectiveness in batch washers. This easy to use product will remove all types of electronic flux residues including the latest lead free. AQUANOX® A4625B is environmentally fri

KYZEN Corporation

DIMA SOLANO RO 510

DIMA SOLANO RO 510

Used SMT Equipment | Soldering - Reflow

hh 5 independent controlled heating zones hh Internal cooling zone hh Integrated Ioniser for ESD safe soldering hh DIMAsoft reflow profiler software available hh Flux traps to minimize contamination of the system hh Easy to service one way appro

Fix Trade BV

DIMA SOLANO RO 510

Used SMT Equipment | Soldering - Reflow

hh 5 independent controlled heating zones hh Internal cooling zone hh Integrated Ioniser for ESD safe soldering hh DIMAsoft reflow profiler software available hh Flux traps to minimize contamination of the system hh Easy to service one way appro

Fix Trade BV

Soldering Immersion Tin

Technical Library | 2019-04-10 22:08:31.0

The stimulating impact of the automotive industry has sharpened focus on immersion tin (i-Sn) more than ever before. Immersion tin with its associated attributes, is well placed to fulfill the requirements of such a demanding application. In an environment dominated by reliability, the automotive market not only has very stringent specifications but also demands thorough qualification protocols. Qualification is ultimately a costly exercise. The good news is that i-Sn is already qualified by many tier one OSATs. The focus of this paper is to generate awareness of the key factors attributed to soldering i-Sn. Immersion tin is not suitable for wire bonding but ultimately suited for multiple soldering applications. The dominant topics of this paper will be IMC formations in relation to reflow cycles and the associated solderability performance. Under contamination free conditions, i-Sn can provide a solderable finish even after multiple reflow cycles. The reflow conditions employed in this paper are typical for lead free soldering environments and the i-Sn thicknesses are approximately 1 μm.

Atotech

Soldering Assembly Services

Soldering Assembly Services

New Equipment | Assembly Services

S-Bond Technologies offers both conventional flux soldering and S-Bond soldering. As an Active Solder, S-Bond solder is flux-free eliminating the potential of contamination and corrosion associated with fluxes. Additionally, S-Bond’s limited capillar

S-Bond Technologies

ULT Canada Sales Incorporated

Industry Directory | Consultant / Service Provider / Manufacturer

ULT is a vendor of efficient fume extraction solutions for air purification. The company's systems are utilized for the removal of laser fumes, soldering fumes, odors, vapors, gases, dusts etc. in electronics production.

ROHS Green Squeegees

ROHS Green Squeegees

New Equipment |  

With the July2006 ROHS deadline approaching SigmaPrint Technologies are now able to supply colour coded �green� Squeegee assemblies. Colour coded squeegees are of great help to customers who are exempt from the directive, helping to ensure that the

SigmaPrint Technologies Ltd

DEK Under-Stencil Cleaning Fabric

DEK Under-Stencil Cleaning Fabric

New Equipment | Cleaning Equipment

DEK SMT High Performance Cleaning Rolls are engineered to boost productivity and yield, reduce the risk of defects and minimise rework. An ideal choice for a superior clean of the stencil underside. To maximise pre-placement yield, it is imperative

ASM Assembly Systems (DEK)

Drive Technologies

Industry Directory | Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Media / Publisher / Online Resource

All Through-hole & SMT PC Board Assembly equipments,Reflow and wavesoldering equipments,Humiseal conformal coating,SCH Technologies conformal coating equipments,Kyzen Cleaning solutions,Metronelec Solderability tester,Curing oven

HEPCO 9400-1 BGA Solder Sphere Placement System

HEPCO 9400-1 BGA Solder Sphere Placement System

New Equipment | Pick & Place

The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array. Alignment is achieved through precision pins and specific tooling for ease of use, re

HEPCO, Inc.


contamination solder searches for Companies, Equipment, Machines, Suppliers & Information

Pillarhouse USA for Selective Soldering Needs

Training online, at your facility, or at one of our worldwide training centers"
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High Throughput Reflow Oven
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World's Best Reflow Oven Customizable for Unique Applications
Selective soldering solutions with Jade soldering machine

High Precision Fluid Dispensers


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