Industry News | 2003-05-30 08:36:25.0
Anticipates Savings Of $25 Million Per Year
Industry News | 2003-02-25 08:07:11.0
Announced that it received Certification Approval From the United States/Canada Joint Certification Office, Defense Logistics Information Service.
Industry News | 2003-03-12 08:14:19.0
Today announced the addition of two leading electronics sales representative firms designed to increase CirTran's domestic sales volume.
Industry News | 2003-01-28 10:29:13.0
Conducted by Wall Street Audio, with Iehab Hawatmeh, President & CEO
Industry News | 2003-04-28 08:12:02.0
The Micro-Meter 2 is an air-operated positive-displacement single-acting two-component system, designed to meter, mix and dispense small 'shots', or beads, of reactive materials.
Industry News | 2003-06-12 08:24:37.0
An adaptive tool prevents small and/or light components "lifting" or "floating" on printed circuit board assemblies during the wave solder process.
Industry News | 2003-03-06 09:02:21.0
The newly added PCB representative firms were chosen for their in-depth knowledge of PCB manufacturing and complimentary line of products.
Industry News | 2009-07-12 14:19:25.0
Seoul Korea — July 2009 — MIRTEC, “The Global Leader in Inspection Technology,” announces that the company has been awarded contracts totaling more than $15M with leading mobile solution manufacturers for its MV-7xi inline automated optical inspection (AOI) systems.
ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc. ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
