Industry Directory | Manufacturer
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
Ideal Power is a contract manufacturer specializing in low to meduim run manufacturing. Ideal Power produces wire harnesses, PCB assemblies, electro-mechanical assemblies, and control panels for various OEM accounts.
New Equipment | Board Handling - Conveyors
Model No: KSUN B350 Automatic vacuum loader MAX PCB`s capacity: 300pcs (0.6mm thickness PCB) cycling time: Approx 6 seconds Power supply: 100-230V AC (customized), single phase Power load: MAX 180 VA Air pressure: 4-6 bar Air volume: MAX 30L
New Equipment | Board Handling - Conveyors
Model No: KSUN 460 Automatic vacuum loader MAX PCB`s capacity: 300pcs (0.6mm thickness PCB) cycling time: Approx 6 seconds Power supply: 100-230V AC (customized), single phase Power load: MAX 180 VA Air pressure: 4-6 bar Air volume: MAX 30L/
Electronics Forum | Mon Aug 19 15:21:17 EDT 2013 | marcelorotofrance
Hi Rollon, thanks for your answer. At this point it seems that cold-start current surge, because the presence of large value capacitors in the power source, exceeds the sensitivity of the protection switches rather than a malfunction. Nevertheless, i
Electronics Forum | Mon Sep 08 08:59:45 EDT 2008 | davef
You're correct: * Sealed relays should not be cracked or have moisture intrusion. * Hand soldering relays is going to be expensive. [Using a mini-solder pot for this might reduce some of the burden.] The good part is that the problem is gross enough
Used SMT Equipment | In-Circuit Testers
2) Controller(s) B180L & RP5700 ** includes switch boxes and cables ** (2) ASRU C Cards (2) Control Xt Cards (18) Hybrid Double Density Pin Cards (2) 6624 Power Supplies (1) Printer Condition: Complete & Operational “Passes Diagnostics”
Used SMT Equipment | In-Circuit Testers
This equipment is located in our upcoming STS Online Auction - February 25 - 28, 2019 1 - Controller 2 - ASRU C Cards 2 - Control Xt Cards 18 - Hybrid DD Cards 2 - 6624A Power Supplies 1 - Pin Verification Fixture
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Industry News | 2003-05-19 08:44:19.0
Two new PCB power connectors offer easy high power wiring (up to 54A) with built-in safety features to prevent incorrect connections and resist strong vibration.
Parts & Supplies | SMT Equipment
System control power (160555) DEK system control power 160555 Description: DEK System Control Power SMPSU, 650W WIDE RANGE I / P (FASTON TERMS) (TXT) Part NO.: 160555 Applicable models: ELA / HORIZON / INFINITY、 if need more info about the
Parts & Supplies | SMT Equipment
System control power (160555) DEK system control power 160555 Description: DEK System Control Power SMPSU, 650W WIDE RANGE I / P (FASTON TERMS) (TXT) Part NO.: 160555 Applicable models: ELA / HORIZON / INFINITY
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-12-18 11:33:57.0
Elevate your electronic manufacturing game with the I.C.T-D600 SMT Dispensing Machine! Precision, safety, and efficiency in one powerful solution. In the dynamic realm of electronic manufacturing, precision and efficiency are not just preferences but essential requirements. Introducing the I.C.T-D600, an automatic glue dispenser machine engineered to enhance production processes across various applications. From chip encapsulation to PCB assembly, SMT red-glue dispensing, LED lens production, and medical device creation, SMT dispensing machine is a versatile solution tailored to meet the demands of the industry. Essential Attributes Of The I.C.T-D600 Automatic Glue Dispenser Machine 1. Compliance with European Safety Standards: The I.C.T-D600 SMT dispensing machine prioritizes not only efficiency but also safety, boasting compliance with European safety standards and holding a CE certificate. This ensures a secure and reliable manufacturing environment, aligning with global quality benchmarks. 2. International Component Quality: Internationally renowned components form the core of the D600 SMT dispensing machine. From Panasonic servomotors to MINTRON CCD, each element is carefully selected, guaranteeing high performance and durability. This commitment to quality components results in a machine that operates seamlessly, reducing downtime and maintenance costs. 3. Impressive Performance Metrics: The SMT dispensing machinedoesn't just meet expectations; it surpasses them with exceptional performance metrics: Maximum Guide Rail Speed: 400mm/s Fastest Injection Valve Speed: 20 spots/sec Dispensing Accuracy: ±0.02mm Repeated Accuracy: ±0.01mm Machine Characteristics: Core Part – Jet Valve The non-contact jet dispensing method ensures high-speed operation (max jet speed: 20 spots/second), high accuracy with a minimum dispensing volume of 5nl, and flexibility with extremely small dispensing volumes. The thermostatic system for the flow channel and sprayer ensures uniform glue temperature, resulting in low maintenance costs and an extended service life. Enhanced Capacity: Non-contact jet dispensing eliminates the need for Z-axis motion. Integrated temperature control technology reduces manual intervention. Automatic glue compensation minimizes artificial regulation time. Dual-track design reduces waiting time. Automatic visual location identification and compensation. Non-contact height detection with laser reduces height detection time. Flexibility: Capable of handling substrates or backings of various sizes. Optional heating module. Independent control of dual tracks with user-friendly software. Fast switching between different product lines. Universal platform suitable for various processes with different glues
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
www.unisoft-cim.com/cells.html - CELLS WORKFLOW is affordable, simple to setup & use yet powerful product & job tracking software for fast New Product Introduction (NPI). The CELLS WORKFLOW software provides total traceability in manufacturing floor
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Events Calendar | Tue Mar 06 00:00:00 EST 2018 - Tue Mar 06 00:00:00 EST 2018 | ,
Electronics in Harsh Environments Conference - Free Pre-Conference Webinar
Career Center | Murphy, North Carolina USA | Engineering
We are seeking a qualified and experienced senior design engineer to join our team. The best candidate will use both mechanical and electrical engineering skills to design innovative power supplies that are highly efficient, rugged, and have high rel
Career Center | BANGALORE, KARNATAKA India | Engineering,Production,Quality Control
WE ARE LOOKING FOR OVERSEAS TIE-UPS FOR CONTRACT MANUFACTURING SERVICES. AGENTS ALSO CAN SEND THE DETAILS OR ANY QUERRIES,ARE WELCOMED OUR URL :www.essenelectronics.com WE HAVE EXCELLENT SET-UP MACHINERY AND MAN-POWER TO PRODUCE WORLD CLASS PRODUC
Career Center | Farrukh Hussain, Pakistan | Engineering,Maintenance
PLC, SCADA, designing circuit or PCB layout, troubleshooting and maintenance, electrical and instrumentation, electronics design, software skill with programming.
Career Center | Karachi, Pakistan | Engineering,Maintenance
PLC, SCADA, designing circuit or PCB layout, troubleshooting and maintenance, electrical and instrumentation, electronics design, software skill with programming.
Power Supply Control from PCB to Chip Core Power Supply Control from PCB to Chip Core As silicon technology advances to enable higher density ASICs, the core logic voltage decreases. The lower voltage, in combination with higher current
KingFei SMT Tech | https://www.smtspare-parts.com/sale-37844486-sm411-safety-control-power-board-j91741087a-j90600400b-sm-machine-board.html
SM411 Safety Control Power Board J91741087A J90600400B SM Machine Board Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
Heller Industries Inc. | https://hellerindustries.com/power-electronics/
Power Electronics -Power Device Packaging Home » Power Device Packaging Power Electronics: Device Packaging The Need for Void-Free Power Electronics Device Packaging The trend today in power electronics is to move towards smaller form factors while maintaining or increasing overall power requirements
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