Industry Directory | Manufacturer
Bones Electronics design and manufacture toroidal transformers,EI lamination transformers,toroidal iron cores wound by sillicon steel tapes. OEM and ODM accept.CE,ROHS,UL,VDE approved.
Industry Directory | Manufacturer
Our machines are famous for stable runnning ,high precision & speed ,light-weight and easy operation ,which also help us win high praises from our clients .
2.0 Cmk @ ± 25 μmProduct description: DEK E Seriels SMT Stencil Printer E by DEK, core cycle time: 8 seconds, Substrate size: 620 mm (X) x 508.5 mm (Y), System alignment capability: > 2.0 Cmk @ ± 25 μm DEK E SMT Stencil Printer DEK E SMT Stenc
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Electronics Forum | Wed May 12 11:55:08 EDT 2010 | pbarton
We are using VPS, but only for high mass assemblies. As the other respondent has suggested if the mass of the assemblies is very low then difficult to control temp. rise times to within the normally accepted parameters. The Rehm equipment does seem
Electronics Forum | Fri May 07 23:43:10 EDT 2010 | jlawson
I assume you using a fixed mass vapour phase system? Yes rates of rise are impacted by the mass of the PCB, larger the mass to mass of vapour phase the lower the rise generally. So if you load the machine with very little mass PCB rise times can be
Used SMT Equipment | In-Circuit Testers
Kikusui PLZ1004W DC Electronic Load (E-Load), 1.5 to 150V, 200A, 1000W , Rise time: 10 Micros (which converts to rise and fall times) high-speed response, Possible to perform actual Load simulation by sequence control function, Equipped with USB
Used SMT Equipment | In-Circuit Testers
Kikusui PLZ1004W DC Electronic Load (E-Load), 1.5 to 150V, 200A, 1000W , Rise time: 10 Micros (which converts to rise and fall times) high-speed response, Possible to perform actual Load simulation by sequence control function, Equipped with USB
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2020-02-18 14:24:01.0
In recognition of their leadership roles and support of IPC standards, education, advocacy and solutions to industry challenges, four of industry’s best and brightest were presented with an IPC Rising Star Award at IPC APEX EXPO 2020. Award recipients were Gaston Hidalgo, Kate Stees, Stephanie Rodgers, and Zhiman Chen.
Parts & Supplies | SMT Equipment
NODE6 controller(191103185130187339) Part Number: 191103/185130/87339 lifting platform motor controller Specifications: MOTOR ^ CONTROLLER ^ 710/810 RISING TABLE NODE6 controller jenny@ksunsmt.com
Parts & Supplies | SMT Equipment
191103/185130/87339 lifting platform motor controller Specifications: MOTOR ^ CONTROLLER ^ 710/810 RISING TABLE NODE6 controller
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Events Calendar | Thu Mar 25 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | ,
Webinar: Process Control to Ensure Electrochemically Reliable Electronics
Power Supply Control from PCB to Chip Core Power Supply Control from PCB to Chip Core As silicon technology advances to enable higher density ASICs, the core logic voltage decreases. The lower voltage, in combination with higher current
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/thermal-compounds?con=t&page=18
. This simple-to-integrate process controller maintains precise temperature control of a dispensing process chamber within +/- 0.1ºC of… Liquidyn P-Jet SolderPlus Jet Valve Operating Manual Nordson EFD Operating manual for the Liquidyn P-Jet SolderPlus valve, including specifications, installation, operation, service, and replacement
| http://www.feedersupplier.com/SMT_THROUGH_HOLE
. The increasing space limitations gave rise to Surface mount technology, and with it, a new era of more compact and portable electronic devices
