Used SMT Equipment | SMT Equipment
Westkleen Triton IV inline Wash System Detergent system Air Knife Wash and Dry Cycles Inline mesh conveyor
Used SMT Equipment | Pick and Place/Feeders
Well maintained Quad 4c refurbed by PPM with Windows XP upgrade. It has a work holder instead of the conveyor. We have had this machine since 2011.
Career Center | New Castle, Pennsylvania USA | Production
Surface Mount Tech - Printed Circuit Board (PCB) Summary: **All applicants must be familiar with: Quad 4C equipment*** Will be responsible for Surface Mount Parts and Screen Printing Other responsibilities may include: Moves controls to activate
Used SMT Equipment | Soldering - Reflow
Mesh conveyor Top and bottom heaters (newer heaters) Cooling section Newer Blowers
Used SMT Equipment | SPI / Solder Paste Inspection
PARMI HS70 3D Solder Paste Inspection Machine (2011) Brand: Parmi Model: HS70 Solder Paste Inspection Machine Serial #: H7S0 Year: 2011 Machine Specifications: Software Version: Parmi 3D SPI v1.5.1.2 Conveyor Inspection Program: Single Lane
Used SMT Equipment | Pick and Place/Feeders
2014 Refurbished QUAD 4000C windows 98 based software Condition is excellent Low hours used for prototyping Machine is 90 deg conveyor for max feeder locations 96 position 3500 CPH with up and down vision and quad align laser Over (200) 8mm
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
Used SMT Equipment | Soldering - Reflow
Key Tech Solutions has a Quad Profile Series Forced Convection Reflow Oven.PC controlled 7 zone high throughput system. Left to Right. * Main Heat Length: 101" inches * Total Heated Length: 117 inches * PCB Process Size: * Belt C
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
Equipment Broker - Used - SMT specialists - Quality Manufacturing Equipment Bought and Sold - Zevatech/Juki /MPM Specialists.
