MDE Semiconductor, Inc. is a market leader in Circuit Protection Products.
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
2 containers of 500g at the same time container diameter:60~66mm for details: www.jwide-smt.com or Mail: sales@jwide-smt.com
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
2 containers of 500g at the same time container diameter:60~66mm for details: www.jwide-smt.com or Mail: sales@jwide-smt.com
New Equipment | Soldering - Other
Mini wave soldering machine Features open canopy-style streamlined shell design, beautiful appearance, easy to clean. The lead-free solder furnace made of stainless steel production. High strength and h
New Equipment | Wave Soldering
Mini wave soldering machine Features open canopy-style streamlined shell design, beautiful appearance, easy to clean. The lead-free solder furnace made of stainless steel production. High strength and hardness special alumi
New Equipment | Wave Soldering
Mini wave soldering machine Features open canopy-style streamlined shell design, beautiful appearance, easy to clean. The lead-free solder furnace made of stainless steel production. High strength and hardnes
New Equipment | Wave Soldering
Mini wave soldering machine Features open canopy-style streamlined shell design, beautiful appearance, easy to clean. The lead-free solder furnace made of stainless steel production. High strength and hardness special aluminum rails, long lifesp
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
Nordson Electronics Solutions makes reliable electronics an everyday reality. Our ASYMTEK, MARCH, and SELECT brands deliver precision fluid dispensing, conformal coating, plasma treatment and selective soldering equipment.
2747 Loker Ave West
Carlsbad, CA USA
Phone: 18002796835
