Full Site - : cookson electronics kleenox p solder oxide (Page 14 of 16)

BGA Straight crack

Electronics Forum | Fri Feb 22 08:26:51 EST 2002 | davef

You are correct. The gold dissolves in the solder. The gold is meant to protect the nickel from oxidizing, so that you can solder to the nickel. Obviously that didn�t work as planned. Your background information is very sparse. Two things come

Stainless Steel tabs in brd assemblies

Electronics Forum | Thu Jan 03 17:00:20 EST 2008 | davef

Recommended procedure for soldering stainless steel [Atlas Steels Australia]: * Surfaces must be clean and free of oxidation. * A rough surface improves adherence of the solder, so roughening with grinding wheel, file or coarse abrasive paper is reco

Re: Cleaning procedures for Entek-Plus Cu-106A

Electronics Forum | Tue Apr 20 22:09:03 EDT 1999 | Earl Moon

| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following

Re: PCB Standards

Electronics Forum | Wed Jun 10 18:40:00 EDT 1998 | Earl Moon

| I am looking for the Industry standards on vias. Are they required to be plated with solder or is copper plating enough? What about reliabilty with either one? Also, if tenting the via is required should it be copper plated or solder plated over

3355-11 Uh oh!

Electronics Forum | Wed Jun 24 13:46:41 EDT 1998 | Chris Kelly

Brian, a couple of things really stick out here... 1) You are spraying what is referred to here at the CATT as "PINK DEATH" The 3355-11 is about the most active/aggressive flux you can get your hands on. I am concerned about both the condition


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