Electronics Forum | Fri Feb 01 18:44:26 EST 2008 | jmelson
I looked at a number of small bench-top batch ovens and saw two things. First, they got VERY expensive when you got above the very smallest units. Mine will fit an 8 x 12" board. I still have to do one that size and see how uniform the temperature
Electronics Forum | Thu Feb 07 13:46:07 EST 2008 | slthomas
I would probably try to get my boss to spring for a digital anemometer (air velocity meter) and figure out what my velocity needed to be to get the specified airflow. Then just check it daily before production starts and when it starts to slow down,
Electronics Forum | Thu Aug 30 20:35:51 EDT 2012 | davef
A common bottomside heater configuration is IR-Convection-Convection. One of the big advantages of the IR zone is its ability to allow the flux carrier to spread and dry slowly before the board reaches the convections zones, which can blow wet flux c
Electronics Forum | Fri May 24 09:34:57 EDT 2013 | markhoch
I run the same profiles for Top and Bottomside assemblies for all of my products. Only in rare instances have I been forced to run a profile with cooler bottom zone settings. This was obviously driven by assemblies with heavier components on the bott
Electronics Forum | Tue Aug 13 06:23:51 EDT 2013 | mccabekev
We are running a Heller 1707 EXL reflow oven, but we have a temperature variation across the board. When the oven first comes up to temperature, the centre of the board is 10degC hotter than the inside rail which is a further 10degC hotter than the
Electronics Forum | Tue Apr 08 08:01:35 EDT 2014 | cyber_wolf
So we had a ringblow pump blow up in our CP642. We replaced it and now we are getting hardware NG errors very intermittently.(2-4 times during and 8 hour shift) I see that the x-motor fan, cam motor fan,and oil cooler are all in this circuit. When i
Electronics Forum | Thu Dec 08 13:34:46 EST 2016 | spitkis2
We are currently experiencing with our SMD Solder > Reflow Equipment on Shooting-Up Zones (Zones > 3,4,5,7 & even Cooling Zone). PV exceeds about > 5-10 degrees with the SP. (ex: SP=140deg, actual > PV = 145deg & higher). Our equipment undergo a
Electronics Forum | Tue Jan 14 11:53:44 EST 2020 | avillaro2020
Hi Phil, thanks. I am successful using the same connector on small thinner boards 2-2.5kg) i cant make it work, tried all kinds of profiles with vapour phase but to no avail. Yes you read it right 4.3-6.3mm pcb thickness and 2-2.5Kg. And it is 44 lay
Electronics Forum | Tue Feb 04 09:21:48 EST 2020 | nhusa
There are two areas that are important when discussing cooling rate. One is the rate thru the liquidus, where a fast rate produces small grains in the metal and a slow rate results in larger grains. Although smaller grains are stronger normal SM
Electronics Forum | Thu Aug 23 20:51:15 EDT 2001 | davef
Every thing you need is in "links" here http://packaging.hp.com/. The only thing you need to do now is find it. Ah, so much information, so little time. Yeh yeh yeh, nice little ESD bags are good. Er, maybe sealed barrier bags might be better. E
