Full Site - : cooling slope (Page 3 of 4)

Wrinkle solder ball on BGA PKG

Electronics Forum | Sat Dec 30 04:23:50 EST 2023 | 012band

I have used LTS (Sn57.6%Bi0.4%Ag) solder balls for soldering on Ni/Au pads, and I have observed a wrinkle pattern on the ball surface. When you attempted soldering on CuOSP substrate pads under the same conditions, the surface appeared normal. Additi

liquidous (indium 8.9hf)

Electronics Forum | Thu Apr 07 11:39:48 EDT 2011 | remullis

My oven profile is 155,160,165,180,220,245,255,227 Cooling Zone 132/92. This is a 8 zone CV820 Technical Devices oven. My assy profile using Datapaq Q18 - Base on one probe feedback - Positive slope (7.09), Pos Slope Time (.45), Rise Time (1.17), Me

Profile control parameters

Electronics Forum | Wed Jan 22 14:53:50 EST 2003 | MA/NY DDave

Hi I thought I would come back to this one for a second. Joe Fox above gave a nice concise note as to why you must raise the temp high enough above the soldering melting temp (liquidus) yet not too high. You want to go high enough for paste so tha

Reflow profile negative temp ramp rates

Electronics Forum | Tue Apr 09 07:41:08 EDT 2002 | johnw

Craig, it depend's n what you want to look at. In term's of te gran structure of the solder jont that's formed when the joint is cooling so you'd want to monitor the temperature drop from the peak or say 215dg C for ref down to probably about 150 an

Lead free profile

Electronics Forum | Sun Feb 27 17:06:18 EST 2005 | Darby

This is the profile we came up with on a 1500 to satisfy the parameters suggested by Indium. This was on an FR4 1mm thick 4 layer pcb that I would descrbe as medium density, QFP, SOP, AL-CAP, TANTS, D-PAK, MINI SPRING COIL, SOT and CHIPS were all use

2 Hot 2 Handle

Electronics Forum | Wed Jan 02 09:24:00 EST 2013 | swag

Thanks for the help. Ramp soak spike but due to the density of this assembly it's more like ramp spike. Yes, leaded. I'm getting similar results with or without the carrier. (I designed the carrier like swiss cheese, full of holes and scallops on

Wave soldering profiling

Electronics Forum | Tue Jun 10 16:51:19 EDT 2003 | davef

Develop your recipe wave soldering exactly as you developed your recipe for reflow soldering. The only difference is that instead of using your paste supplier's recommendations as the starting point, use your flux supplier's recommendations as a bas

QFP Removal

Electronics Forum | Tue Feb 17 17:55:38 EST 2004 | bman

I might be saying something that will get me laughed off of SMTnet forever, but when faced with a similar problem here's what I did. Since I was removing parts I didn't see why I would be concerned about all the things that go on in a good temperatu

via under a smd pad ?

Electronics Forum | Sat Nov 24 15:44:28 EST 2007 | mika

Hi DaveF, I had a short look into the Nr1. IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION Most interesting reading, but one thing though, I could not find any information about the oven profile. Just a picture of it. My question is of about the

Re: The best way to erase flux from the golden fingers?

Electronics Forum | Mon Aug 21 20:17:08 EDT 2000 | Dave F

Hey Gyver: Oooow, using a pencil eraser has to take time. I would hate to be the person responding to your customer trying to explain the pencil eraser shreds accidentally left on the board. Awww, just spritz it with DI water and wipe it off with


cooling slope searches for Companies, Equipment, Machines, Suppliers & Information

Online Equipment Auction Jabil Monterrey MX Aug 19, 2024

Software for SMT placement & AOI - Free Download.
Win Source Online Electronic parts

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Fluid Dispensing, Staking, TIM, Solder Paste

Training online, at your facility, or at one of our worldwide training centers"
High Throughput Reflow Oven

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...