Technical Library | 2017-08-17 12:28:30.0
At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process. Examples including: Large low stand-off components such as QFN, LGA Components covered under electromagnetic shield which has either no or few venting holes Components assembled within cavity of board Any other devices with small open space around solder joints
Industry News | 2020-07-07 13:48:00.0
CyberOptics® Corporation (NASDAQ: CYBE) announces that it was awarded a 2020 EM Asia Innovation Award in the category of Test Equipment-Testing Software Suite for its CyberCMM™. The award was presented to the company during a ceremony that took place July 3, 2020 at the National Exhibition and Convention Center in Shanghai.
Industry News | 2020-10-29 08:13:02.0
CyberOptics® Corporation (NASDAQ: CYBE) announces that it was awarded a 2020 Mexico Technology Award in the category of Software – Process Control for its CyberCMM™. The award was announced during a Virtual Award Ceremony that took place Monday, October 26, 2020.
Technical Library | 2018-05-23 12:12:43.0
Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop.
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
Industry News | 2008-11-25 16:50:00.0
Release Date: 1-Nov-2008
Industry News | 2019-08-15 07:31:59.0
AXI is short for automated X-ray inspection, it's one of the most commonly used approaches for defect inspection in PCB Assembly.
Industry News | 2007-09-14 09:28:37.0
Chalman Technologies is new CT USA Representative
Industry News | 2007-09-27 12:21:24.0
Techsystems International is now Cyber Technologies' Contact in the Region
Industry News | 2007-10-11 14:26:03.0
i-TECH.com is the new Cyber Technologies Representative
