Industry News | 2007-11-27 12:01:32.0
FINETECH application packages offered for FINEPLACER� rework systems provide an easy way to enhance the machine�s scope of application. These packages include custom-tailored modules and tools to ensure perfect results for special rework applications.
Industry News | 2011-02-23 20:06:19.0
Juki Corporation introduces the JX-200LED for the LED assembly market. Targeted specifically for LED manufacturing, the JX-200LED features new algorithms created for the placement of side- and top-view LEDs.
Industry News | 2013-11-01 13:32:41.0
Indium Corporation's Indium8.9HFA Solder Paste is a versatile, halogen-free, Pb-free, solder paste with leading print performance on miniaturized components. Assemblers and OEMs are adopting this remarkable new product at an accelerating pace.
Industry News | 2018-02-26 11:01:41.0
Nordson DAGE welcomes a new member to its family of award-winning X-ray inspection systems. Quadra™ 3 is specifically designed for high-quality X-ray inspection in PCBA production applications.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2013-07-15 14:58:08.0
Mobility is the driving force in electronics.
Industry News | 2015-02-25 14:32:37.0
ViTrox Technologies, announces that it has been awarded two 2015 NPI Awards in the categories of Test & Inspection – AOI and AXI for its V810 S2 EX In-Line AXI and V510 Optimus 3D AOI. The awards were presented to the company during a Tuesday, Feb. 24, 2015 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. The addition of the two awards bring ViTrox to a total of 10 industry awards for its AXI and AOI capabilities.
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
Industry News | 2017-10-17 19:47:15.0
Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Hall A2 Booth 445 at productronica 2017, scheduled to take place Nov. 14-17, 2017 at the Messe München in Germany.
Industry News | 2009-09-17 14:28:17.0
NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Mike Bixenman, CTO, along with co-author Mike Konrad, President of Aqueous Technologies, will hold a presentation titled “Cleaning for Reliability Post QFN Rework” at the upcoming SMTA International conference, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
