New Equipment | Rework & Repair Equipment
Ultimate Performance, BGA Rework Station for small-large PCBs up to 24"/620mm The PDR E6 XL BGA Rework Station is made of only the finest materials and components for optimum precision and rework excellence. PDR's E6 SMD Rework Station is PDR's larg
Electronics Forum | Fri Oct 11 16:25:43 EDT 2013 | scdunlap
Also coplanarity can be poor on these parts so overprinting the paste (beyond the pad perimeter) can increase volume to insure robust solder joint.
Electronics Forum | Thu Aug 21 16:58:25 EDT 2003 | justin
With a eutectic ball, you'll see about a 50% collapse. This negates that .008" issue you're referring to. With a high temp ball, you don't enjoy the same freedom regarding ball collapse. Dave is correct, though. We recently got IBM to sign up to
Industry News | 2008-07-03 21:21:50.0
OXFORD, CT � July 2, 2008 � MIRTEC Co. Ltd. announces that sales revenue for its North American Sales and Service Division grew by more than 81 percent for the first six months of fiscal 2008 with respect to 2007 results.
Industry News | 2020-10-03 08:34:38.0
MIRTEC is pleased to announce that Energy Conversion Applications (ECA), Inc., a full-service EMS provider specializing a full range of turnkey and hybrid solutions for PCB assembly including custom cables & harness, coil winding and complete box build assembly, has selected MIRTEC as their AOI partner with the purchase of an MV-3L Desktop AOI Machine.
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Parts & Supplies | SMT Equipment
Juki 505 506 nozzle for 2050 smt machine Description: Brand:JUKI Nozzle model:500 501 502 503 504 505 506 507 508 Application:Juki 2050 2060 smt machine Customize:yes Advantage: 1.The juki nozzle core is different, it suitable for RC, varica
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Parts & Supplies | SMT Equipment
JUKI 7501 nozzle for RSE high speed smt machine Description: Brand:JUKI Type:juki 7501 7502 7503 7504 7505 7506 7507 7508 nozzles Application:RSE high speed smt machine Advantage: 1.The juki nozzle core is different, it suitable for RC, varic
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2011-04-07 14:50:29.0
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size, such as a near die-sized footprint, thin profile, and light weight; (2) easy PCB t
LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch
The X3 is an automatic X-Ray inspection system featuring combined Transmission and 3D Technology for sophisticated high-speed inspection in electronic production. The system is based on the motion concept of the MatriX X2.5 AXI system. A newly develo
PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation
Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4798
BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes 中文 MEMBERS LOGIN Membership Become a Member
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
application. An HVM ready tool has been developed for this process. From theoretical analysis and experimental data, the system shows clear technical advantage of improving solder bump coplanarity, which provides better solder volume and height allowance for
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