Industry News | 2014-02-10 14:46:04.0
Metcal today announced the venue for the second stop on the 2014 rework tour. The workshop is scheduled to take place March 5-6, 2014 at the Biltmore Hotel & Suites in Santa Clara, CA The workshop will provide tips to unlock the challenges of rework.
Industry News | 2016-03-07 20:31:29.0
Viscom today announced plans to introduce a new model of its successful S3088 ultra 3D AOI system family at the IPC APEX EXPO in Las Vegas. The S3088 ultra gold reaches image data rates of up to 3.6 gigapixels per second. The core of this system is the innovative high performance camera module XMplus with its outstanding, high throughput camera technology.
Technical Library | 2010-05-27 22:12:10.0
The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages of QFNs are well documented, concerns arise with its reliability and manufacturability. Acceptance of this package, especially in long-life, severe-environment, high-reliability applications, is currently limited. One of the most common drivers for reliability failures is inappropriate adoption of new technologies, such as the case with QFN. In this presentation, we will review and discuss QFN related reliability concerns and challenges, and propose Physics-of-Failure (PoF) based approaches to allow the confident introduction of QFN components into electronics products.
Technical Library | 2019-07-23 22:33:47.0
The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.
Industry News | 2011-09-28 19:53:50.0
AIM announces that Karl Seelig, Vice President of Technology, will present a paper titled “Overcoming the Challenges of QFNs” at the upcoming SMTA International Conference & Exhibition.
Industry News | 2019-08-04 20:09:21.0
STI Electronics announces two technical paper presentations in September at the SMTA International Technical Conference (SMTAI).
Industry News | 2011-04-20 17:38:48.0
Multitest announces that its well-established ECON® contactor once again has proven its superior cost of test. The contactor recently exceeded 4.5 mio insertions at an Asian test house.
Industry News | 2011-11-27 00:38:42.0
Multitest announces that the usage of its Gemini™ Kelvin is rapidly increasing at two longstanding customers, both of which rank among the top 25 IDMs.
Industry News | 2018-03-25 13:21:16.0
The widest selection of online webinars in the industry has added more titles
Technical Library | 2015-07-14 13:19:10.0
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names, such as QFN (quad flat no lead), DFN (dual flat no lead), LGA (land grid array) and MLF (micro lead-frame. BTC assembly has increased rapidly in recent years. This type of package is attractive due to its low cost and good performance like improved signal speeds and enhanced thermal performance. However, bottom terminated components do not have any leads to absorb the stress and strain on the solder joints. It relies on the correct amount of solder deposited during the assembly process for having a good solder joint quality and reliable reliability. Voiding is typically seen on the BTC solder joint, especially on the thermal pad of the component. Voiding creates a major concern on BTC component’s solder joint reliability. There is no current industry standard on the voiding criteria for bottom terminated component. The impact of voiding on solder joint reliability and the impact of voiding on the heat transfer characteristics at BTC component are not well understood. This paper will present some data to address these concerns.
