Industry News | 2012-07-02 09:45:46.0
No has been selected as a Best of West finalist for its X-Plane™ Analysis – Sub Micron X-Ray Inspection System Option.rdson DAGE
Industry News | 2016-01-19 15:21:34.0
Etek Europe are proud to announce that they have been appointed as the UK and Irish distributor for PDR – IR Rework Systems. This appointment extends their distribution coverage which currently includes Algeria, Bulgaria, Finland, Hungary, Norway, Poland, Qatar, Romania, Saudi Arabia, Sweden, Tunisia, Ukraine, and United Arab Emirates.
Industry News | 2019-10-17 15:21:23.0
PDR is pleased to announce that It will exhibit in Hall A2, Booth 534 at productronica, scheduled to take place Nov. 12-15, 2019 at the Neue Messe München in Munich, Germany. Both the E6S Evolution Rework System and E3G Gold Rework System will be at the show for demonstrations. Additionally, the company will unveil a semi-automated version of the popular E6 Series at the show.
Industry News | 2020-10-16 14:02:30.0
Visiting Equipment Experience and Provision of Noncontact X-ray Results Reporting Service
Industry News | 2015-07-01 14:49:18.0
MiTAC Computer (ShunDe) Ltd., part of MiTAC-Synnex Group (联华神通集团), announced that after the successful installation and operation of first the ViTrox V810 XXL (AXI) in mainland China in 2014, its subsidiaries that focus on EMS services successfully installed first ViTrox V810 S2EX (AXI) in mainland China in January 2015.
Technical Library | 2021-04-08 00:30:49.0
As the electronic industry moves to lead-free assembly and finer-pitch circuits, widely used printed wiring board (PWB) finish, SnPb HASL, has been replaced with lead-free and coplanar PWB finishes such as OSP, ImAg, ENIG, and ImSn. While SnPb HASL offers excellent corrosion protection of the underlying copper due to its thick coating and inherent corrosion resistance, the lead-free board finishes provide reduced corrosion protection to the underlying copper due to their very thin coating. For ImAg, the coating material itself can also corrode in more aggressive environments. This is an issue for products deployed in environments with high levels of sulfur containing pollutants encountered in the current global market. In those corrosive environments, creep corrosion has been observed and led to product failures in very short service life (1-5 years). Creep corrosion failures within one year of product deployment have also been reported. This has prompted an industry-wide effort to understand creep corrosion
Industry News | 2010-09-29 23:32:58.0
Christopher Associates/Koki Solder announce that Jasbir Bath will present a paper titled “An Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes to Reduce Voiding in Large Contact Area Power Transistor/QFN Type Components” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2013-10-22 12:00:17.0
Panasonic Factory Solutions Company of America announces the appointment of Systems, Materials, & Technologies Inc. (SMT Inc.) as a sales representative of Panasonic electronics assembly solutions in Northern California and Northwest Nevada.
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
Industry News | 2016-07-08 19:09:41.0
Carlsbad, CA – July 8: Machine Vision Products (MVP) today announced it would be demonstrating their diverse inspection toolbox on the MVP 850 Platform for Microelectronics and Packaging at the Semicon West 2016 exhibition. Applications will include Lead Frame inspection for die placement, epoxy and wire bond as well as demonstrating new surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 12-14 2016. Machine Vision Products are exhibiting at booth #6471 in the North Hall.
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