Industry News | 2016-07-08 19:09:41.0
Carlsbad, CA – July 8: Machine Vision Products (MVP) today announced it would be demonstrating their diverse inspection toolbox on the MVP 850 Platform for Microelectronics and Packaging at the Semicon West 2016 exhibition. Applications will include Lead Frame inspection for die placement, epoxy and wire bond as well as demonstrating new surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 12-14 2016. Machine Vision Products are exhibiting at booth #6471 in the North Hall.
Industry News | 2017-07-07 17:15:03.0
Carlsbad, CA – July 7, 2017: Machine Vision Products (MVP) today announced it would be demonstrating its Die Wire Metrology System (DWMS) and Semiconductor Automated Optical Inspection solutions at the Semicon West exhibition. These latest capabilities are available on MVP's 2020 and 850G Platforms. Applications demonstrated will include die wire metrology, wire bond, wafer and surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 11-13, 2017. Machine Vision Products are exhibiting at booth #7724 in the West Hall (Level 1).
Industry News | 2017-10-17 19:59:54.0
CyberOptics® Corporation will demonstrate the SQ3000™-DD 3D Automated Optical Inspection (AOI) system with the new Ultra-High Resolution Multiple-Reflection Suppression (MRS) Sensors in Hall A4, Stand 239 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany. The company also will unveil the new SE3000™ 3D SPI and SQ3000™ 3D CMM, both powered by MRS technology.
Industry News | 2021-08-13 12:16:35.0
CyberOptics® Corporation (NASDAQ: CYBE) will feature the WX3000™ metrology and inspection system with MRS™ sensor technology, and high-precision sensors for semiconductor tool set-up and diagnostics at the VirtualConnecting Heterogeneous Systems Summit Sept. 1-3, 2021.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2020-09-06 04:37:56.0
CyberOptics® Corporation (NASDAQ: CYBE) will present at the SEMICON Taiwan Global SiP Summit on September 24, 2020 at 4:20pm. Tim Skunes, VP of R&D at CyberOptics, will share the technical presentation 'Fast, 100% 3D Wafer Bump Metrology and Inspection to Improve Yields and 3D System Integration'.
Industry News | 2020-11-18 15:38:26.0
CyberOptics® Corporation (NASDAQ: CYBE) will present at the Virtual IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) on December 16th at 8:00amCT.
Industry News | 2017-10-17 19:47:15.0
Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Hall A2 Booth 445 at productronica 2017, scheduled to take place Nov. 14-17, 2017 at the Messe München in Germany.
Industry News | 2023-10-12 20:54:48.0
Atlanta, Georgia – Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will deliver live demonstrations of its award-winning inspection machines and smart factory software during the SMTA Guadalajara Expo and Tech Forum in Jalisco, Mexico on October 25-26, 2023. Additionally, Heriberto Cuevas, Regional Sales Manager for Mexico will take part in a roundtable about the application of artificial intelligence for automated optical inspection.
Industry News | 2024-02-26 14:00:02.0
High-performance memory supplier chooses Saki's 3Si solder-paste inspection and 3Di inline AOI systems to handle miniaturization challenges and prepare for smart manufacturing.
