Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Electronics Forum | Wed Dec 27 21:12:30 EST 2000 | Dave F
From a process perspective, I don�t know if you should be concerned ... You've told us nothing about your process. THE BOOK JEDEC MO-51 allows 6 thou warp in smaller [1mm pitch] BGA and 8 thou in larger [ 1.27mm and 1.5mm pitch] BGA. The increase
Electronics Forum | Fri Mar 18 03:53:16 EST 2005 | devilhitam
hi guys, I need a help here. Does anyone know what is the standard for coplanarity check for fine pitch IC that well practiced? I am using SIEMENS F5 for fine pitch IC placement.SIEMENS F5 do have the capability for coplanarity check. My customer re
Electronics Forum | Wed Oct 27 17:10:14 EDT 1999 | Jerry Stafford
Guys, I am not really looking for an automatic system. I am looking for as automated a system as I can get for $30K or less. I would really prefer something under $10K. I just need a way to sample devices to see if the vendor is meeting my coplana
Electronics Forum | Thu Aug 09 07:53:16 EDT 2012 | davef
Allowable bow & twist: Together, both IPC-A-600G and IPC-6012B represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards. IPC-A-600G relies
Electronics Forum | Sat Jul 22 13:20:35 EDT 2023 | shrikant_borkar
Dear Abhishek, I too got the opportunity to investigate this defect Lift lead for SOT. Lead lift in IC, and SOT can occur due to various reasons. Here are some possible reasons for lead lift and ways to avoid them: During the assembly process, mecha
Electronics Forum | Sun Apr 18 03:58:26 EDT 1999 | P.L. Sorenson - Technical Consultant
| While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | I thought I'd ask some experts. Any help guys? | To remove moisture from low quanti
Electronics Forum | Wed Nov 01 13:28:41 EST 2000 | Fraser
Thomas, Dave is right - we had a similar coplanarity problem on some BGAs which we solved simply by over printing - no step required by nearly 2 x what happens is that the paste hight will grow as the paste reflows confined by the pad drop me line a
Electronics Forum | Mon Mar 21 22:02:32 EST 2005 | dlkearns1
I'd say you already have some documentation, from the customer requirements, eh? I'd also say that regarless of any "standard", if your customer wants xxmils, give it to them, unless of course you'll have to go "above and beyond" what you think is re
Electronics Forum | Tue Mar 27 06:37:14 EDT 2007 | realchunks
There is no "standard" or "procedure". Your customer is putting a requirement on you because this has probably lead to weak QFP solder joints breaking in the field or non-functioning units due to co-planar QFP legs. I�ve been there done that. Had
