Industry News | 2011-03-31 14:12:56.0
Seica's innovative test and assembly solutions are being used across the globe to improve quality, increase productivity and save money in automobile, military and consumer markets. At Nepcon Shanghai we will showcase the following products and solutions...
Industry News | 2020-07-07 13:48:00.0
CyberOptics® Corporation (NASDAQ: CYBE) announces that it was awarded a 2020 EM Asia Innovation Award in the category of Test Equipment-Testing Software Suite for its CyberCMM™. The award was presented to the company during a ceremony that took place July 3, 2020 at the National Exhibition and Convention Center in Shanghai.
Industry News | 2020-10-29 08:13:02.0
CyberOptics® Corporation (NASDAQ: CYBE) announces that it was awarded a 2020 Mexico Technology Award in the category of Software – Process Control for its CyberCMM™. The award was announced during a Virtual Award Ceremony that took place Monday, October 26, 2020.
Industry News | 2013-07-15 14:58:08.0
Mobility is the driving force in electronics.
Industry News | 2018-01-16 10:38:59.0
Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that it will exhibit on stands F35 and F60 at Southern Manufacturing, scheduled to take place February 6th – 8th at FIVE in Farnborough, Hampshire.
Industry News | 2017-03-07 09:28:32.0
Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that it will exhibit on stands J19 and J20 at Southern Manufacturing, scheduled to take place March 21st – 23rd at FIVE in Farnborough, Hampshire.
Industry News | 2015-02-25 14:32:37.0
ViTrox Technologies, announces that it has been awarded two 2015 NPI Awards in the categories of Test & Inspection – AOI and AXI for its V810 S2 EX In-Line AXI and V510 Optimus 3D AOI. The awards were presented to the company during a Tuesday, Feb. 24, 2015 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. The addition of the two awards bring ViTrox to a total of 10 industry awards for its AXI and AOI capabilities.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2013-01-30 13:06:03.0
Seica will be an exhibitor at the 2013 IPC APEX show being held in San Diego this year. Visitors are welcome to booth #627 to learn more about the industry leading ATE and functional test systems, an impressive array of the latest Seica product developments: The featured systems in booth #627 will include the Pilot V8 Flying Prober, the Firefly Laser Selective Soldering system, and the Compact TK Functional and In-Circuit Test system.
Industry News | 2017-10-17 19:47:15.0
Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Hall A2 Booth 445 at productronica 2017, scheduled to take place Nov. 14-17, 2017 at the Messe München in Germany.
