Industry News | 2017-01-17 15:39:40.0
STI Electronics today announced that it has been selected to receive the “Best of Conference” award for a paper presented during SMTA International in September. The paper entitled “BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes” was co-authored by Dr. Mike Bixenman of KYZEN, and Mark McMeen and Jason Tynes from STI Electronics.
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Industry News | 2020-07-07 13:48:00.0
CyberOptics® Corporation (NASDAQ: CYBE) announces that it was awarded a 2020 EM Asia Innovation Award in the category of Test Equipment-Testing Software Suite for its CyberCMM™. The award was presented to the company during a ceremony that took place July 3, 2020 at the National Exhibition and Convention Center in Shanghai.
Industry News | 2020-10-29 08:13:02.0
CyberOptics® Corporation (NASDAQ: CYBE) announces that it was awarded a 2020 Mexico Technology Award in the category of Software – Process Control for its CyberCMM™. The award was announced during a Virtual Award Ceremony that took place Monday, October 26, 2020.
Industry News | 2008-11-25 16:50:00.0
Release Date: 1-Nov-2008
Industry News | 2019-08-15 07:31:59.0
AXI is short for automated X-ray inspection, it's one of the most commonly used approaches for defect inspection in PCB Assembly.
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
Industry News | 2013-07-15 14:58:08.0
Mobility is the driving force in electronics.
Industry News | 2007-11-27 12:01:32.0
FINETECH application packages offered for FINEPLACER� rework systems provide an easy way to enhance the machine�s scope of application. These packages include custom-tailored modules and tools to ensure perfect results for special rework applications.
Industry News | 2018-02-26 11:01:41.0
Nordson DAGE welcomes a new member to its family of award-winning X-ray inspection systems. Quadra™ 3 is specifically designed for high-quality X-ray inspection in PCBA production applications.
