Technical Library | 2018-05-23 12:12:43.0
Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop.
Industry News | 2017-10-17 19:47:15.0
Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Hall A2 Booth 445 at productronica 2017, scheduled to take place Nov. 14-17, 2017 at the Messe München in Germany.
Industry News | 2021-06-11 03:10:46.0
More and more customers switch their SMT BGA QFN soldering quality from X-ray sampling check to 100% fully inline inspection to guarantee its products quality, previously only in automotive, medical, military and aerospace industries, nowadays also applied into high-end consumer electronics PCBA assembly.
Industry News | 2020-12-18 11:33:06.0
Silergy Device Functions as a Completely Autonomous Metrology Processor in a 5x5mm 32-pin QFN package
Industry News | 2004-11-19 16:12:06.0
St. Charles, IL November 1, 2004 - Perllo Technologies LLC and ECM Electronics Ltd. announce the release of the new environmentally friendly ECxxC series of lead-free power inductors for introduction into the North American Automotive Market.
Industry News | 2014-03-26 19:17:33.0
The world’s premier automated programming system receives its second industry award since its introduction.
Industry News | 2016-02-17 17:30:41.0
Nordson YESTECH announced today that they will launch their latest innovation in 3D inspection in Booth #1745 at the IPC APEX EXPO, scheduled to take place in Las Vegas, USA from 15th – 17th March 2016.
Industry News | 2017-01-10 14:55:25.0
Data I/O Corporation will showcase the PSV7000 with process control software solutions to meet demanding requirements from Automotive and Internet-of-Things applications in Booth #2741 at the IPC APEX EXPO, scheduled to take place February 14th – 16th at the San Diego Convention Center in San Diego, CA.
Industry News | 2014-07-15 14:38:39.0
Kyzen announces that it will exhibit AQUANOX® A4639 Electronic Assembly Aqueous Solution at the SMTA Philadelphia Expo & Tech Forum, scheduled to take place Tuesday, August 12, 2014 at the Crowne Plaza Philadelphia in New Jersey.
Industry News | 2016-03-31 03:00:48.0
The fully integrated MTCS-CDCAF sensor chip solution: Guarantees defined light
