Industry News | 2003-06-11 13:37:07.0
With efficiencies better or comparable to competing implementations in the MLF/QFN/Power Block packages, these new devices in the LITTLE FOOT SO 16 feature a 38% or smaller standard footprint, simplifying design, assembly, soldering, and layout.
Industry News | 2005-05-27 14:03:22.0
Devices Offer Direct Battery Operation and Choice of Configurations
Industry News | 2024-03-18 11:44:31.0
Product demos of industry leading PSV7000 and PSV3500 automated programming solutions, VerifyBoost™ for Lumen®X delivers a 64% increase in programming performance and ConneX® Service, enables two-way integration between PSV Programming Systems and Manufacturing Execution System "MES" for enhanced quality, efficiency, and traceability.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Electronics Forum | Thu Aug 09 07:53:16 EDT 2012 | davef
Allowable bow & twist: Together, both IPC-A-600G and IPC-6012B represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards. IPC-A-600G relies
