Electronics Forum | Thu Mar 02 07:54:07 EST 2006 | davef
Here's some explanations: http://www.psaudio.com/articles/hum.asp http://www.signweb.com/neon/tips/neontip12.html We like the 'don't know the words' one.
Electronics Forum | Thu Nov 01 10:09:18 EDT 2007 | slthomas
Lke Pete C said it's specified by the manufacturer of the paste, but it's also board specific. We print a lot faster on boards with nothing smaller than 50 mil pitch than we would on 16.
Electronics Forum | Fri Jul 09 07:14:36 EDT 2010 | cobar
http://www.shanelo.co.za/reflow_profile_adjustment.htm http://www.shanelo.co.za/how_to_profile_a_pcb.htm http://www.shanelo.co.za/SMD%20Assist.htm
Electronics Forum | Mon Jul 12 04:52:50 EDT 2010 | cksam
Thanks for the information about the reflow profiling its really useful for me to set up my own profile.
Electronics Forum | Mon Jul 12 05:01:30 EDT 2010 | cobar
Please follow the paste suppliers specs for the paste as an indicator.Most people think that if they follow the paste suppliers recommendations to the T it will be a perfect profile but this is not the case.Play around with preheat settings but follo
Electronics Forum | Thu Jan 12 02:08:47 EST 2006 | adeline_ko
Hi, What is the different between Electroless Nickel / Immersion Gold (ENIG) and Immersion Au. Are they refer to the same finishing? We has been using the Gold thickness (0.00005 - 0.00013mm) , nicket (0.0025mm) for all Gold finishing brd (Immersio
Electronics Forum | Fri Nov 02 07:20:43 EDT 2007 | hussman
Why look at buying expensive equipement when you can have your board house multi-up a panel of boards for you. You just saved at least $150,000 American, didn't have to re-evaluate any solder paste, and even opened your process window on your oven.
Electronics Forum | Sat Nov 17 11:36:16 EST 2007 | etienne
On a Dek Horizon 03 the tact time for one panel measuring 400mm print stroke took me 16 seconds at a speed of 55mm/sec. I see no reason for reducing further tact time since loading and unloading PCBs from Pick & Place machines is relatively close.
Electronics Forum | Tue Jul 06 00:23:11 EDT 2010 | cksam
I am doing the case study of the component chip 0201 tombstoning problem. The significant causes was the reflow profiling preheat slope or ramp up rate. I really can't differential between preheat slope and ramp up rate. Could anyone here show me the
Electronics Forum | Thu Nov 01 22:19:57 EDT 2007 | lvzhu
The solder that we used is kester EM918 and Multicore LS328. Our printer machine is DEK-photon, this machine has supply below 300mm/s. the datasheet solderpaste of speed range is 30 to 150mm/s. when we produce the keyboard of the moble phone, this bo
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