New Equipment | Solder Materials
Indium Corporation is a developer, manufacturer, and global supplier of: specialty solders (including solder paste, preforms, spheres, columns, wire, tubing, ribbon, and foil), fluxes, electrically-conductive adhesives, inorganic compounds (including
New Equipment | Assembly Services
Ideal for hand-held to large storage devices, Rigid Flex Circuits and Assemblies combine the benefits of flexible copper circuitry and rigid PCB circuitry into a unitized power and signal solution for superior reliability, system cost savings and opt
Electronics Forum | Mon Nov 07 11:26:23 EST 2005 | CW
How large of chip capacitor can we use reliably? I��ve heard they tend to crack. I��ve also heard if you pre heat the larger chip caps (1812 and above) before vapor phase reflow, they won��t crack. If I use 2 mil copper for a power supply board, a
Electronics Forum | Tue Nov 08 05:00:23 EST 2005 | rlackey
Hi CW, Regarding orientation, yes, your diagram is right - see the following link for confirmation. http://search.murata.co.jp/Ceramy/image/img/A18X/C2EB3C.PDF Regarding information on bending strength you want to talk to your local Murata office
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2018-10-18 07:56:58.0
Wave soldering process defectives and handling solution
Technical Library | 2013-03-28 16:18:22.0
For the last couple of years, the main concerns regarding the electrical performance of blank PCB boards were impedance and ohmic resistance. Just recently, the need to reduce insertion loss came up in discussions with blank board customers (...) The paper describes the test vehicle and the testing methodology and discusses in detail the electrical performance characteristics. The influence of the independent variables on the performance characteristics is presented. Finally the thermal reliability of the boards built applying different copper foils and oxide replacements was investigated.
Technical Library | 2020-01-09 00:00:30.0
PCBs have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.
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https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
SMTnet Express, August 16, 2018, Subscribers: 31,259, Companies: 11,015, Users: 25,092 Reliable Young's Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance Method Kazuki Kammuri, Atsushi Miki, Hiroki Takeuchi; JX
SMTnet Express, November 22, 2017, Subscribers: 31,034, Companies: 10,792, Users: 24,082 Factors Affecting the Adhesion of Thin Film Copper on Polyimide David Ciufo, Hsin-Yi Tsai and Michael J. Carmody; Intrinsiq Materials Inc. The use of copper
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