PCB pad circuit repair using epoxy. Using multiple angles including overhead and from both right and left angles the BEST instructor staff demonstrates plainly how to repair a PCB pad using the epoxy method. This method is per IPC 7721 4.4.1. http://
Technical Library | 2016-10-20 18:13:34.0
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Industry News | 2022-05-18 13:01:33.0
Heraeus Electronics today announced the launch of its new PowerCu Soft Laser Ribbons (LRB) for Laser Bonding during PCIM Europe in Nuremburg. This innovative optimized copper ribbon is proven to effectively achieve more efficiency and stability in power electronic systems. It enables module operation temperatures higher than 250°C and allows the highest power density designs.
As requirements are increasing, so are electronic systems becoming smaller and smaller and more complex. In its role as innovative forerunner Heraeus, the precious metals and technology company, has reacted to precisely this continuing trend towards
This multilayer, high-frequency coupler, shown above, is used within a communications application for the telecom industry. Multilayer High Frequency Coupler Specifications: Product Description This Multi-Layer High-Frequency Coupler is used with
EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
FPC laser cutting machine http://www.vcutpcbdepaneling.com Email?sales@yushunli.com evaliu@yushunli.com Website?http://www.hk-yush.com /http://www.pcbdepanelingmachine.com http://www.vcutpcbdepaneling.com / http://www.yushunli.com / http://www.smtcj.
Industry News | 2019-11-05 22:10:56.0
Many customers and electronic designers were asking questions about the aluminum-based board, today our chief technical official Luca Zhang shared the knowledge and experience to you.
Axial- Radial & Dip Inserter DIP section Radial section AXIAL RADIAL INSERTER Radial section Manufacturer Blakell FUJI Model Robin (0036) FBA 8300 (0013+ 0014) Type Axial/Radial/Dip Inserter Axial /Radial Metric Vintage 1991 Serial Nu