Industry News | 2011-12-14 15:03:10.0
Nihon Superior will showcase a new and expanded range of products based on its SN100C® silver-free, lead-free solder in booth East 30-13 at the upcoming Internepcon Japan exhibition. SN100C now has a track record of more than 12 years of successful delivery of high productivity and high reliability.
Industry News | 2016-04-18 11:30:07.0
Kester will be represented through our German sales partners, ADL Prozesstechnik UG (booth # 7-426) and EURO TOOL GmbH (booth # 7-520), at SMT Hybrid Packaging 2016, which will take place April 26-28 at the Exhibition Centre in Nuremberg, Germany.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Electronics Forum | Sat Jun 11 07:51:15 EDT 2016 | davef
Hi Steve ... There are arguments between fabricators and thermal relievers about adding non-connected copper tabs to barrels in hopes of providing thermal relief, but that's not what you're talking about, I believe. I don't foresee an issue moving t
Electronics Forum | Fri Jan 07 09:03:44 EST 2022 | jineshjpr
Hi Everyone, I want to understand what is the copper thickness to be maintained in PTH Barrel hole. Is this same as Fab recommendation of surface finished copper thickness like 25/35/70 microns..??? Is there any specific IPC standards available to un
Electronics Forum | Thu Apr 14 15:27:05 EDT 2022 | ppcbs
If it was ROHS I would suspect copper migration. In my experience an acceptable copper finish should last up to at least 6 reflow cycles. If you have bubbles or blow holes in the solder joint, that is a sign of voids in the walls of the copper barre
Electronics Forum | Thu Aug 10 13:36:48 EDT 2000 | Bob Willis
I recently have been examining multilayer board failures. They are the classic inner connection failure between the foil and the through hole plating which I have not seen in many years. Has any one experienced any issues recently specifically relati
Electronics Forum | Sat Dec 10 07:03:59 EST 2005 | mdemos1
Hi. I am trying to find out the minimum copper thickness I should see on a through hole barrel. The board has 1 ounce copper and the board thickness is 0.062". I am finding thicknesses of 0.6 to 1.2 mils. Thanks, Mike.
Electronics Forum | Fri Oct 08 09:43:27 EDT 2004 | davef
First, don't get too excited about the thermal capabilities of conductive epoxy. An epoxy like DuPont CB-100 increases the amount of heat conducted through the barrel, but many over estimate what it can do. Calculations show for a 0.020" drilled
