Electronics Forum | Thu Mar 29 07:37:45 EDT 2012 | davef
The current discussion about solder fountains has to do with copper dissolution. Broadly, copper dissolution is the weakening of copper traces where a trace and a barrel plating intersect due a loss of the copper into the solder. Longer contact time
Electronics Forum | Thu Apr 18 16:52:15 EDT 2002 | davef
General comments are: * First place I would look is the supplier of the pins that you are trying to install. Most suppliers that sell press fit components have done a good deal of work to qualify the component and will have all the specifications yo
Electronics Forum | Thu Aug 17 17:36:08 EDT 2006 | slthomas
I don't have any data (haven't tried this), but it doesn't take much thought to see that determining the risks associated with simultaneously applying compressive and rotational forces to the end of the barrel, not to mention chewing up the copper, i
Electronics Forum | Wed Nov 05 18:39:06 EST 2008 | joeherz
Hello, We have recently installed a selective soldering machine and are seeing some voiding/cratering in random locations. We have done some basic experimenting with fluxing parameters, preheat and dwell times but haven't been able to eliminate it.
Electronics Forum | Mon Nov 19 10:37:53 EST 2007 | ck_the_flip
Bruce, Does the thicker barrel plating for "RoHS-Rated" PCBs alleviate some of the copper dissolution that one might experience from SAC305? Also, for those SN100c experts out there, is Sn100c less likely to dissolve copper?
Electronics Forum | Thu Jun 29 12:07:09 EDT 2017 | georgetruitt
HOW THICK IS THE BOARD? IS THERE A LOT OF COPPER IN THE BOARD? DOES YOUR CUSTOMERS PROVIDE HEAT RELIEF IN THE BOARDS BARREL DESIGN THERE NEEDS TO BE PLENTY OF ROOM FOR LEADFREE SOLDER TO FLOW, DID YOU CHECK YOUR PIN(LEAD)TO HOLE (BARREL) RATIO? N
Electronics Forum | Fri Feb 22 14:22:07 EST 2008 | stevek
Are you using nocleans, especially when you get to SMT? Years ago, I had OA wave flux get into vias that were plugged from the top under parts. It is really difficult to clean small, high aspect ratio vias. Cross sections showed that the copper in
Electronics Forum | Fri Aug 18 10:55:31 EDT 2006 | Chunks
Steve, You almost got yout Man Card revoked for stating: "determining the risks associated with simultaneously applying compressive and rotational forces to the end of the barrel". Luckily you bounced back with "chewing up the copper". Just pokin
Electronics Forum | Tue Apr 28 07:22:46 EDT 2020 | stephendo
Are you watching for copper dissolution? At one place I was asked to check why we had no barrels with some PTH locations. It was being dissolved in the solder fountain during rework.
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