Industry News | 2022-05-18 12:32:37.0
Heraeus Electronics today announced the launch of its new Condura®.ultra Ag free AMB Substrate. A cost-efficient, highly reliable, Ag free AMB substrate that enables bonding silicon-nitride-based ceramics with copper foils, Condura®.ultra was developed using a special technique enabling high-performance Si3N4 substrates by using new, Ag free active metal brazing (AMB) bonding technology.
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
Industry News | 2019-11-05 22:10:56.0
Many customers and electronic designers were asking questions about the aluminum-based board, today our chief technical official Luca Zhang shared the knowledge and experience to you.
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
Industry News | 2017-08-15 20:47:04.0
BTU International will exhibit in Booth #430 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. BTU will showcase new technology to support Industry 4.0 during the two-day exhibition.
Industry News | 2017-08-26 20:24:13.0
BTU International today announced plans to introduce its new TrueFlat technology, an optional configuration of the PYRAMAX™ convection reflow oven. The unique technology for substrate flatness will be introduced for the first time in Booth 1314 at SEMICON Taiwan, scheduled to take place Sept. 13-15, 2017 at the Taipei Nangang Exhibition Center in Taipei, Taiwan.
Industry News | 2017-09-18 15:30:41.0
BTU International is pleased to announce that Paul Lancaster, Director of Sales – Americas, will participate in a panel discussion during SMTA International. The panel discussion, entitled, “Optimizing Oven Dynamics – The Next Step in Smart Factory Automation,” is schedule to take place Tuesday, Sept. 19, 2017 at 10:30 a.m. at the Donald E. Stephens Convention Center in Rosemont, IL.
Industry News | 2017-09-19 16:49:59.0
BTU International introduced its new Profile Guardian redundant process monitor to the North American market during SMTA International at the Donald Stephens Convention Center in Rosemont, IL. This new technology has been developed to support Industry 4.0 at the request of automotive electronics manufacturers.
Industry News | 2017-10-17 19:15:13.0
BTU International today announced plans to introduce its new PYRAMAX™ Vacuum reflow oven. The system will be on display for the first time in Hall A3, Stand 154 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany with EPP Electronic Production Partners GmbH.
Industry News | 2018-01-24 21:25:37.0
BTU International will exhibit in Booth #927 at the 2018 IPC APEX EXPO, scheduled to take place February 27 - March 1, 2018 at the San Diego Convention Center in CA. The company plans to exhibit its new PYRAMAX™ Vacuum reflow oven.