New Equipment | Solder Materials
Flux designed specifically to work with KappZapp7, 7.0% Silver solder to remove the oxide layer on Copper to allow a strong metallic bond between the solder and the base metal. Its active range is 500°F - 750°F (260°C - 390°C). Kapp Copper-Bond Flux
Aluminum Bonded Copper or �ABC� represents a quality alternative to copper/aluminum lamination separator plates. Continuous process ultrasonic welding performed in a clean room environment is the basis surrounding ABC�s product technology. Critical m
Industry Directory | Manufacturer
Oak-Mitsui specializes in the development and production of world class performance foils, Aluminum Bonded Copper, and FaradFlex� Buried Capacitance� materials.
Used SMT Equipment | Semiconductor & Solar
Standard Machine features and system description: Ultra-fine pitch and small ball bonding capabilities High frequency transducer operating at 138 kHz Applicable wire size of 0.6mil-2.0mil High speed XY table with linear motor technology High ac
Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,
Qualification and Reliability of Microvias
Technical Library | 2014-07-24 16:26:34.0
Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.
New Equipment | Assembly Services
Edge Plating does not have a set definition per IPC. However, the industry generally accepts this as being copper plating that continues from the top and bottom surfaces and along one or more perimeter edges. Edge Plating can be used for a variety of
Alternative to Brazing S-Bond can be an alternative lower temperature joining process and replace brazing in some applications. S-Bond is very effective in soldering aluminum to aluminum as well as soldering aluminum to copper.
New Equipment | Board Handling - Storage
BTU: A Leading Manufacturer of High Temperature Controlled Atmosphere Furnaces Thick Film Firing Direct Bond Copper, Brazing, Sintering & Heat Treating Glass-to-Metal Sealing Diverse Atmospheres, Air, Nitrogen, Hydrogen & Forming
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