Industry Directory | Manufacturer
Leading manufacturer and exporter of a wide range of Electrical Components including Earth Rods, Copper Earth Rods, Earthing Clamps, Earth Rod Clamps, Earth Bonds, Earthing Accessories, Earthing Terminals, Earthing Nuts and more.
Industry Directory | Manufacturer's Representative
hybrid circuit and direct bond copper electronics manufacturer
New Equipment | Solder Materials
Galvanite solder is a lead-free formulation designed specifically for high quality repairs to galvanized steel surfaces. Galvanite is simple, effective and easy to use, in both manufacturing and field applications. Just like the original galvanizing,
Electronics Forum | Tue Mar 14 16:26:45 EST 2006 | patrickbruneel
BeCu is not solderable without plating Cu, Sn, Ag, Ni etc. The solder joint will only be as strong as the bond strength of the solderable plating to the BeCu Pat
Electronics Forum | Mon Sep 09 21:54:01 EDT 2013 | mandysmile
Hi, rod, The exposed copper area you could do with ENIG. It is with good solderability.
Used SMT Equipment | Semiconductor & Solar
Standard Machine features and system description: Ultra-fine pitch and small ball bonding capabilities High frequency transducer operating at 138 kHz Applicable wire size of 0.6mil-2.0mil High speed XY table with linear motor technology High ac
Used SMT Equipment | SMT Equipment
ADBHF8060 QP351E-OF SAM6580 SERVO MOTOR SGMAH-A5A1A4C (AC,50W,Multi Phase) MTU9E(TY) SAM6590 SERVO MOTOR SGMAH-04A1A4C (AC,400W,Multi Phase) MTU9E(TZ) SAM6600 SERVO MOTOR SGMM-A1C3FJ14 (AC,10W,Multi Phase) QP341E/NP1(Q) POWER SUPPLY P/N:T4195E D
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Industry News | 2013-10-28 16:31:54.0
IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.
Parts & Supplies | Assembly Accessories
Km1-m7105-a0x KM1-M7105-00X PLUG 2 ASSY head rod lower air seat Specification: KM1 - M7105 - A0X Product Remarks: YAMAHA YV100II Lower part of head holder, copper sleeve KM1-M7105-00X PLUG 2 Product Category: YAMAHA head rod YangYingLong Sal
Parts & Supplies | Assembly Accessories
Product Name: KM8-M712S-A0 YV100II Nozzle Rod with Copper Sleeve KM9-M7107-A0X Head Rod Set Specification: KM8 M712S - A0 Remark: YV100II nozzle holder with copper sleeve Product Category: YAMAHA head rod
Technical Library | 2014-12-11 18:00:09.0
The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Wire bonded packages using conventional copper lead frame have been used in industry for quite some time. However, the demand for consumer electronics is driving the need for flip chip interconnects as these packages shorten the signals, reduce inductance and improve functionality as compared to the wire bonded packages. The flip chip packages have solder bumps as interconnects instead of wire bonds and typically use an interposer or organic substrate instead of a metal lead frame (...) The paper provides a general overview of typical defects and failure modes seen in package assembly and reviews the efforts needed to understand new failure modes during package assembly. The root cause evaluations and lessons learned as the factory transitioned to thin form factor packages are shared
Technical Library | 2017-08-31 13:43:48.0
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction
This video demonstrated the use of BEST Inc HotDots(TM) which allow wires to be affixed to the PCB or other surfaces-even when those surfaces go through reflow. There are other similar products out there but none of which can be readily customized no
PCB pad circuit repair using epoxy. Using multiple angles including overhead and from both right and left angles the BEST instructor staff demonstrates plainly how to repair a PCB pad using the epoxy method. This method is per IPC 7721 4.4.1. http://
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,
Qualification and Reliability of Microvias
SMTnet Express, July 24, 2014, Subscribers: 22981, Members: Companies: 13953, Users: 36523 Copper Wire Bond Failure Mechanisms. Randy Schueller, Ph.D.; DfR Solutions Wire bonding a die to a package has traditionally been performed using either
| http://etasmt.com/cc?ID=te_news_industry,26963&url=_print
: The double-sided board is a printed circuit board with copper coated on both sides including Top (top) and Bottom (bottom). Both sides can be wired and soldered
Heller Industries Inc. | https://hellerindustries.com/browse/page/237/
: 459157-03---Drive Shaft Part, Woven18-16-16 (303 Stainless Steel) 459172---MOVABLE RAIL ASSY, CLS, 25mm Rod, With Rollers 459177---MOVABLE RAIL ASSY, CLS, 20mm Rod, With Rollers 459229---LACING CLIPS
