Industry Directory | Distributor
Suppliers to the PCB Industry with a huge range of products including copper clad laminates, drill boards and consumables.
Industry Directory | Manufacturer
Manufacturer of PCB laminates. The products includes full series of FR-4 copper clad laminates, prepreg,CEM-1,CEM-3, etc.
New Equipment | Education/Training
IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o
New Equipment | Education/Training
This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac
Industry News | 2003-04-04 08:21:57.0
The deal emphasizes PIAD�s commitment to being a major supplier to the UK printed circuit market and enhances Crossley & Bradley�s position as a leading distributor of copper-clad laminates in the UK
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Technical Library | 2021-03-04 15:22:33.0
Copper clad laminates (CCLs) with low dissipation factor (Df) are urgently needed in the fields of high-frequency communications devices. A novel resin matrix of modified poly (2,6-dimethyl-1,4- phenylene ether) (MPPE) and styrene-ethylene/butylene-styrene (SEBS) was employed in the fabrication of high-frequency copper clad laminates (CCLs). The composites were reinforced by E-glass fabrics, which were modified with phenyltriethoxysilane (PhTES). The composite laminates obtained exhibited impressive dielectric loss of 0.0027 at 10 GHz when the weight ratio of MPPE to SEBS was 5:1.
Technical Library | 2017-08-24 16:53:20.0
With the rapid development of the information industry, increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs. In addition to the increasingly high performance requirements of CCL's, the present global attention to less toxic products is leading to an increase in the use of halogen-free flame retardants in electronics. (...) This paper introduces a new phosphonate oligomer which can be used as a reactive flame retardant in epoxy based resin systems. Suitable conditions for the complete reaction between the phosphonate oligomer and epoxy resin are described and the resulting halogen-free laminates with improved properties such as low Df, low coefficient of thermal expansion (CTE), high peel strength, and good toughness are presented.
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Career Center | Laguna Niguel, California USA | Management,Production,Quality Control,Research and Development,Sales/Marketing
Marc S. Strickland 29703 Niguel Rd. #H. Laguna Niguel, Ca. 92677 (Tel) 949-363-5350 EXPERIENCE: Multi-Fineline Electronix Inc. Anaheim, Ca. Jan 2000 to Feb 2002 Production Manager � Increased monthly shipments from $2.5M to $5M � Managed produc
SMTnet Express, August 24, 2017, Subscribers: 30,744, Companies: 10,648, Users: 23,699 Development of Halogen Free, Low Loss Copper-Clad Laminates Containing a Novel Phosphonate Oligomer Dr. Lawino Kagumba - FRX Polymers Inc. ., Yang Zhong Qiang
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_IPCDesigner_CID.pdf
• Considerations for Design • Placement and Routing Techniques • Electrical Characteristics • Copper Clad Laminates • Holes in Printed Boards
Imagineering, Inc. | https://www.pcbnet.com/blog/causes-of-pcb-warping-how-to-prevent-it/
. Addressing Environmental Factors Improper storage of substrates can lead to increased risk of warpage. Particularly in environments with high humidity, copper clad laminates can absorb moisture
