Full Site - : copper crack (Page 13 of 20)

The truth about lead-free and environment

Electronics Forum | Fri Mar 24 12:16:37 EST 2006 | patrickbruneel

Darn Rob you're brilliant You just solved the dilemma of micro cracks and hot tear in lead free, just add a softer metal like.....and the joints won't crack. You wrote "BTW: Lead is far softer & dissolves far more easily than copper or tin, hence wh

Reducing Warp after reflow

Electronics Forum | Mon Oct 31 19:37:16 EDT 2022 | emeto

Just because you can't add copper to the board, doesn't mean you can't add copper to the panel. Redesign panel, where board house can add copper to the panel to balance the board a little better. I would advise against low melting solder alloys on cu

press fit on Ni/Au board finish

Electronics Forum | Thu Apr 18 16:52:15 EDT 2002 | davef

General comments are: * First place I would look is the supplier of the pins that you are trying to install. Most suppliers that sell press fit components have done a good deal of work to qualify the component and will have all the specifications yo

Porosity in Good Plating

Electronics Forum | Fri Jul 04 21:09:04 EDT 2003 | ramanandkini

I have a CEM-1 PCB board with 35 microns copper. This is PCB is finished with SMOBC+HALS. We do solder SMT LEDs, but till date we do not have problems that you have listed. The LEDs are good & bright. It even passed high & low temp cycle tests (-40 t

BGA SEM test

Electronics Forum | Wed Jul 27 17:01:14 EDT 2005 | Dreamsniper

Issue: At 60'C test PCB Fails. Operator did simulation. Use of Heat Gun to heat up the BGA to 60'C while PCB is powered and running. At 60'C BGA fails. When pressed system is back which means that something becomes open. Sent BGA for SEM and found t

Is anyone using K100 bar solder? Why or why not?

Electronics Forum | Fri May 12 12:07:10 EDT 2006 | solderiron

The kester better known as KY'd Sn/Cu has more copper intermetallic growth over time, dissolves copper from the board faster so repairing and touchup can damage board. Bridges more than SN100c. Does not thermal cycle well. Has shrink cracks that can

Cracking solder joints

Electronics Forum | Mon Feb 01 16:40:45 EST 1999 | Dave Waddick

I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product is

SN100C vs. SAC 305 wave soldering

Electronics Forum | Fri Dec 30 16:50:48 EST 2005 | fctassembly

250 tons/month) and, as it has been stated here, many customers have switched from SAC305 to SN100C but we are not aware of any customer who has switched from SN100C to SAC305. As the inventor of SN100C states, �once a customer touches the SN100C, he

Re: Cracking solder joints

Electronics Forum | Tue Feb 02 12:31:26 EST 1999 | John

| I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product i

Lead free compatibility

Electronics Forum | Mon Dec 05 17:53:04 EST 2005 | KEN

I hate to sound like a broken record but the industry has been placing lead free through-hole parts forever. Now all of a sudden its a problem??? Gold finish, silver, silver paladium, alloy 42, even pure copper. Reliability will be a function of t


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