Industry Directory: copper fill (4)

GS Swiss PCB AG

Industry Directory | Consultant / Service Provider / Manufacturer

Manufacturer of highly miniaturized and high reliability PCBs. Swiss Quality substrates for demanding applications such as implants and medical devices. HDI flex, rigid-flex and rigid PCBs in small to medium volumes.

LaserJob

Industry Directory | Manufacturer

Founded in 1992, LaserJob specializes in laser-cut stencils for printed circuit boards used in electronic devices.

New SMT Equipment: copper fill (17)

IPC-A-600H Standard

IPC-A-600H Standard

New Equipment | Education/Training

IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o

BEST Inc.

IPC 6012C Qualification and Performance Specification for Rigid Printed Boards

IPC 6012C Qualification and Performance Specification for Rigid Printed Boards

New Equipment | Education/Training

This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac

BEST Inc.

Electronics Forum: copper fill (89)

conductive fill via

Electronics Forum | Mon Nov 11 11:28:32 EST 2002 | davef

Sand is not a great conductor, compared to copper. Never heard of using the stuff on RF boards. Our board fabricator uses Dupont CP100, now CP101, [or something like that cuse who's going to check?] when plugging via on cheap boards. Your board fa

Improving PTH fill using select solder

Electronics Forum | Mon May 14 16:36:58 EDT 2012 | davef

You're thinking correctly in trying to improve your process. Can you change to a more active flux? Look at the copper that connects to the center pin. You may need to relay-out the board to add a wagon wheel style thermal relief in that area.

Industry News: copper fill (89)

Best Technical Paper at IPC APEX EXPO Selected

Industry News | 2015-02-15 17:55:40.0

The best technical conference paper of IPC APEX EXPO 2015 has been selected. Voted on through a ballot process by members of IPC’s Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, February 24.

Association Connecting Electronics Industries (IPC)

IPC Releases Revision D for IPC-6012, Qualification and Performance Specification for Rigid Printed Boards

Industry News | 2015-09-30 10:08:42.0

IPC — Association Connecting Electronics Industries® has released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. IPC delivers the most current specifications for rigid printed board requirements to the electronic industry. The newly updated revision D will be release in conjunction with IPC-6012DS, Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, which addresses requirements for space and military avionics.

Association Connecting Electronics Industries (IPC)

Technical Library: copper fill (17)

Ground Pours - To Pour Or Not To Pour?

Technical Library | 2011-02-17 18:03:21.0

Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias to ground. Usually, small isolated areas

In-Circuit Design Pty Ltd

Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper

Technical Library | 2019-06-26 23:21:49.0

Copper-filled micro-vias are a key technology in high density interconnect (HDI) designs that have enabled increasing miniaturization and densification of printed circuit boards for the next generation of electronic products. Compared with standard plated through holes (PTHs) copper filled vias provide greater design flexibility, improved signal performance, and can potentially help reduce layer count, thus reducing cost. Considering these advantages, there are strong incentives to optimize the via filling process. This paper presents an innovative DC acid copper via fill formulation, for VCP (Vertical Continues Plating) applications which rapidly fills vias while minimizing surface plating.

MacDermid Inc.

Videos: copper fill (9)

Electrovert's  DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind.  The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave.  This

Electrovert's DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave. This

Videos

Electrovert's DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave.

ITW EAE

LED PCB separator |PCB separator|aluminum PCB separation

LED PCB separator |PCB separator|aluminum PCB separation

Videos

http://www.pcb-separator.com ??????????? ???????? ????/?????/V??????????????/LED depaneling equipment/separator/LED separator manufacturer/supplier/

ASCEN Technology

Training Courses: copper fill (3)

IPC-6012 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-6012 Specialist (CIS)

The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.

Blackfox Training Institute, LLC

Events Calendar: copper fill (2)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Qualification and Reliability of Microvias

Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,

Qualification and Reliability of Microvias

CALCE Center for Advanced Life Cycle Engineering

Career Center - Resumes: copper fill (2)

Jerry McBeth Resume

Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development

Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting

3+ years of experience in the PCB CAM engineering

Career Center | Erode, Tamilnadu India | Engineering

Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou

Express Newsletter: copper fill (214)

SMTnet Express - May 12, 2022

SMTnet Express, May 12, 2022, Subscribers: 25,588, Companies: 11,569, Users: 27,213 Electronics Manufacturing Technical Articles Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future

SMTnet Express - June 27, 2019

SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key

Partner Websites: copper fill (85)

PCB Libraries Forum : PCB Via Terms and Applications

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_pcb-via-terms-and-applications_topic1596.xml

: a technology that allows to design VIP (via in pad) because of flatness surface. Copper via filling as resin via filling plus copper capping are the two main technological solution available today. Solder Mask Covered: a pad or via (via tenting

PCB Libraries, Inc.

Blackfox: How to Make a Printed Circuit Board at Home - Blackfox

Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-how-to-make-a-printed-circuit-board-at-home/

: How to Make a Printed Circuit Board at Home You are here: Home News & Events Blackfox: How to Make a… A printed circuit board (PCB) is a device that mechanically supports and electrically connects electronic components using conductive tracks, pads, and other features etched from copper sheets laminated onto a non-conductive

Blackfox Training Institute, LLC


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Circuit Board, PCB Assembly & electronics manufacturing service provider

High Precision Fluid Dispensers
Void Free Reflow Soldering

Wave Soldering 101 Training Course
Encapsulation Dispensing, Dam and Fill, Glob Top, CSOB

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Sell Your Used SMT & Test Equipment

Reflow Soldering 101 Training Course
PCB Handling Machine with CE

Software for SMT placement & AOI - Free Download.
SMT spare parts

Thermal Transfer Materials.