Industry Directory | Manufacturer
Oak-Mitsui specializes in the development and production of world class performance foils, Aluminum Bonded Copper, and FaradFlex� Buried Capacitance� materials.
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
Industry Directory | Distributor
Suppliers to the PCB Industry with a huge range of products including copper clad laminates, drill boards and consumables.
Technical Library | 2018-08-15 17:27:28.0
Smartphones and tablets require very high flexibility and severe bending performance ability of the flexible printed circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs, the extraordinary highly flexible, treated rolled-annealed (RA) copper foils have recently used instead of regular RA foil and electro deposited foils. It is very important to measure the Young's moduli of these foils predicting the mechanical properties of FPCs such as capabilities of fatigue endurance, folding, and so on. Even though the manufacturers use IPC TM-650 2.4.18.3 test method for measuring Young's modulus of copper foils over many years, where Young's modulus is calculated from the stress–strain (S–S) curve, it is quite difficult to obtain the accurate Young's modulus of metal foils by this test method.
Industry Directory | Manufacturer
JX Nippon engages in the development of non-ferrous metals that include copper, gold, and silver. It also manufactures electro-deposited and treated rolled copper foils that are used in PCBs.
