Thermally Managed � Heat Dissipating PCB�s (Printed Circuit Boards) By STABLCOR Corporation STABLCOR TM Printed Circuit Board Material Product Information STABLCOR Corporation has developed a new printed circuit board technology that has the followin
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Factory supply cable utp cat5e and cat6 lan cable 305m (Rhonda(at)z-crown.com cable utp cat5e: 1.Conductor:24AWG,bare copper 0.51 +/-0.01 mm, 2.Insulation: High density polyethylene, minimum thickness of 0.19 mm 3.Conductor diameter 0.92 +/- 0
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Factory supply cable utp cat5e and cat6 lan cable 305m (Rhonda(at)z-crown.com cable utp cat5e: 1.Conductor:24AWG,bare copper 0.51 +/-0.01 mm, 2.Insulation: High density polyethylene, minimum thickness of 0.19 mm 3.Conductor diameter 0.92 +/- 0
Technical Library | 2019-02-13 13:45:11.0
Development of information and telecommunications network is outstanding in recent years, and it is required for the related equipment such as communication base stations, servers and routers, to process huge amount of data in no time. As an electrical signal becomes faster and faster, how to prevent signal delay by transmission loss is a big issue for Printed Circuit Boards (PCB) loaded on such equipments. There are two main factors as the cause of transmission loss; dielectric loss and conductor loss. To decrease the dielectric loss, materials having low dielectric constant and low loss tangent have been developed. On the other hand, reducing the surface roughness of the copper foil itself to be used or minimizing the surface roughness by modifying surface treatment process of the conductor patterns before lamination is considered to be effective in order to decrease the conductor loss. However, there is a possibility that reduction in the surface roughness of the conductor patterns will lead to the decrease in adhesion of conductor patterns to dielectric resin and result in the deterioration of reliability of PCB itself. In this paper, we will show the evaluation results of adhesion performance and electrical properties using certain type of dielectric material for high frequency PCB, several types of copper foil and several surface treatment processes of the conductor patterns. Moreover, we will indicate a technique from the aspect of surface treatment process in order to ensure reliability and, at the same time, to prevent signal delay at the signal frequency over 20 GHz.
Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in
Tachyon-100G laminate materials are designed for very high-speed digital applications up to and beyond speeds of 100 Gb/s. Tachyon 100-G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature
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Multilayer PCB、Metal base PCB、Hi-Tg heavy copper foil PCB、Flat winding multilayer PCB、High frequency PCB、Mixed dielectric base high frequency multilayer PCB. Developing and manufacturing all kinds of
280°C). Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required. RO4003C was designed with a dielectric constant of 3.38. The RO4350B has a dielectric constant of 3.48 and is UL94V-0 rated. RO445
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Cheap PCB Manufacturing Fr4/CEM3 PCB The most common PCBs, for every PCB supplier, most cost-effective. High Tg PCB More heat resistant, better dimensional stability, PS is a PCB supplier of Tg130-190 boards (FR4).
