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SMT Process Engineer

Career Center | Lincoln, Nebraska USA | Engineering

Brief Description of Job Duties: Provide new program engineering support with emphasis on technical SMT process development. Key activities would include recommendations and implementation of components, SMT pad design, solder methods, testing and r

Molex, Incorporated

SMT Process Engineer

Career Center | Lincoln, Nebraska USA | Engineering

Provide new program engineering support with emphasis on technical SMT process development. Key activities would include recommendations and implementation of components, SMT pad design, solder methods, testing and reliability for both rigid and foi

Molex, Incorporated

Multycircuit Technology Limited

Industry Directory | Manufacturer

Multilayer PCB、Metal base PCB、Hi-Tg heavy copper foil PCB、Flat winding multilayer PCB、High frequency PCB、Mixed dielectric base high frequency multilayer PCB. Developing and manufacturing all kinds of

Speedline Omni 7

Speedline Omni 7

Used SMT Equipment | Soldering - Reflow

Speedline Omni 7 Reflow Oven Model: Omni 7 Vintage: 2003 Warranty: 30 Days THE OMNIFLO Each OmniFlo model features the same design criteria and the same robust construction. Our central design theme is to minimize the number of parts in the

Recon Inc

New BTU Reflow Ovens

New BTU Reflow Ovens

New Equipment | Board Handling - Storage

BTU: A Leading Manufacturer of High Temperature Controlled Atmosphere Furnaces Thick Film Firing  Direct Bond Copper, Brazing, Sintering & Heat Treating  Glass-to-Metal Sealing  Diverse Atmospheres, Air, Nitrogen, Hydrogen & Forming

WittcoSales, Inc.

DUPONT™ - High Performance PCB Laminates (HPL)

DUPONT™ - High Performance PCB Laminates (HPL)

New Equipment | Materials

Pyralux® LF Copper-clad Laminate DuPont™ Pyralux® LF has been an industry standard in high reliability applications in the avionics industry for over 30 years and has a proven record of consistency and dependability and is ideal for aerospace and m

INSULECTRO

High reliability Copper Clad Laminate

High reliability Copper Clad Laminate

New Equipment |  

170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T

Mica-AVA (Far East) Industrial Ltd

SMT Stencil Printers for PCB Assembly

SMT Stencil Printers for PCB Assembly

Videos

http://www.ddmnovastar.com/stencil-printers - DDM Novastar Stencil Printers are designed for short to medium run PCB assembly. Ranging from manual to semi-automatic, these durable, easy-to-use systems provide repeatable, reliable results. Greatly r

DDM Novastar Inc

Nihon Superior to Premier New SN100C Products at APEX 2009

Industry News | 2009-03-10 16:11:29.0

OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.

Nihon Superior Co., Ltd.

IR2005 IR Infrared BGA Rework System

IR2005 IR Infrared BGA Rework System

New Equipment | Rework & Repair Equipment

No need of nozzles, no airflow during re-flow process. Use non-contact infrared temperature sensor to measure temperature real-timely, and achieve closed loop control of temperature during rework process, especially suitable for lead free process.

Plastlist Group


copper foil reflow searches for Companies, Equipment, Machines, Suppliers & Information

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
Circuit Board, PCB Assembly & electronics manufacturing service provider

High Precision Fluid Dispensers
SMT Machines

High Throughput Reflow Oven
SMT feeders

Training online, at your facility, or at one of our worldwide training centers"
Assembly Automation Technology

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