Full Site - : copper foil reflow (Page 15 of 113)

Stencil Technology for SMT production

Industry News | 2018-10-18 08:39:14.0

Stencil Technology for SMT production

Flason Electronic Co.,limited

Indium Corporation Sintering Expert to Present at EPTC

Industry News | 2023-12-11 12:32:10.0

Indium Corporation R&D Sintering Project Manager Demi Yao will deliver a presentation on pressure-less copper sintering paste for die-attach applications at the Electronics Packaging Technology Conference (EPTC) on December 8 in Singapore.

Indium Corporation

How to Prevent Short Circuits to Ground in QFN Components?

Industry News | 2018-10-18 08:29:16.0

How to Prevent Short Circuits to Ground in QFN Components?

Flason Electronic Co.,limited

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Industry News | 2018-10-18 10:16:53.0

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Flason Electronic Co.,limited

Analysis of Laminate Material Properties for Correlation to Pad Cratering

Technical Library | 2016-10-20 18:13:34.0

Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.

CALCE Center for Advanced Life Cycle Engineering

Indium Corporation Announces SMTA South China Presentations

Industry News | 2021-08-13 08:33:52.0

Five Indium Corporation experts will participate in the SMTA South China Conference, Aug. 25-27, Shenzhen, China. This event is held in conjunction with NEPCON Asia 2021 at the Shenzhen Convention & Exhibition Center.

Indium Corporation

Shenzhen KEYOU PCB Co.,Ltd

Industry Directory | Manufacturer

Established in 2003,Shenzhen Keyou PCB Co. Ltd is a professional high-tech factory that is engaged in PCBs manufacturing,including high-precision double sided and multilayer circuit boards from China.

SMT Stencil Printers for PCB Assembly

SMT Stencil Printers for PCB Assembly

Videos

http://www.ddmnovastar.com/stencil-printers - DDM Novastar Stencil Printers are designed for short to medium run PCB assembly. Ranging from manual to semi-automatic, these durable, easy-to-use systems provide repeatable, reliable results. Greatly r

DDM Novastar Inc

Low Cycle Fatigue Behaviour of Multi-joint Sample in Mechanical Testing

Technical Library | 2013-03-21 21:24:49.0

This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints, which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. The paper explores the relative stress conditions on the distributed joints and the sensitivity to ball joint shape... First published in the 2012 IPC APEX EXPO technical conference proceedings

National Physical Laboratory

New Yorker Electronics releases two new Electrocube High Temperature Film Capacitors

Industry News | 2021-09-10 13:38:57.0

Electrocube 433D & 463D Series Manufactured with Teflon® for use in Extremely High Temperature Applications

New Yorker Electronics


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