Full Site - : copper foil reflow (Page 16 of 113)

Low Cycle Fatigue Behaviour of Multi-joint Sample in Mechanical Testing

Technical Library | 2013-03-21 21:24:49.0

This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints, which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. The paper explores the relative stress conditions on the distributed joints and the sensitivity to ball joint shape... First published in the 2012 IPC APEX EXPO technical conference proceedings

National Physical Laboratory

Isola Expands Commercial Production of I-Speed(R) PCB Materials Into Asia

Industry News | 2013-12-18 15:18:53.0

Isola Group had successfully transitioned the manufacturing of its low-loss, I-Speed material to Asia. The move was in response to an increased demand for I-Speed products. The cost benefits of manufacturing in Asia have enabled a price reduction of I-Speed for printed circuit board (PCB) fabricators located in the Asia-Pacific region.

Isola Group

MacDermid Alpha Releases CircuEtch 200 Anisotropic Final Etch for SAP and mSAP

Industry News | 2020-11-03 13:18:05.0

MacDermid Alpha Electronics Solutions announces the release of CircuEtch 200, a high performance anisotropic final etch for circuit formation in Semi-Additive and modified-Semi-Additive processes (SAP/mSAP) utilized in IC substrate and substrate-like HDI manufacturing.

MacDermid Alpha Electronics Solutions

Reflow oven zone temperature set up and thermal profile

Industry News | 2018-10-18 08:42:00.0

Reflow oven zone temperature set up and thermal profile

Flason Electronic Co.,limited

Time Temperature setting wave soldering is the most important in the solder melts

Industry News | 2018-10-18 09:27:40.0

Time Temperature setting wave soldering is the most important in the solder melts

Flason Electronic Co.,limited

DuPont Circuit & Packaging Materials Introduces Pyralux® TK Flexible Circuit Materials for High Speed and High Frequency Printed Circuit Boards

Industry News | 2010-04-12 16:09:04.0

RESEARCH TRIANGLE PARK, N.C. — DuPont Circuit & Packaging Materials (CPM) introduced its newest high-performance laminate for printed circuit boards. DuPont™ Pyralux® TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. DuPont™ Pyralux® TK delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today.

DuPont

Isola Introduces Low Loss, Low Skew, High-Speed Materials for Printed Circuit Board Fabrication

Industry News | 2013-07-22 17:01:59.0

Isola Group S.a.r.l. announced today its new low loss, low skew, high-speed material, GigaSync™. This product has been engineered to eliminate skew issues in high-speed designs that use differential pairs to create a balanced transmission system able to carry differential (equal and opposite) signals across a printed circuit board.

Isola Group

Factors That Influence Side-Wetting Performance on IC Terminals

Technical Library | 2023-08-04 15:27:30.0

A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.

Texas Instruments

Factors That Influence Side-Wetting Performance on IC Terminals

Technical Library | 2024-04-08 15:46:36.0

A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.

Texas Instruments

How to Export Gerber Files from Eagle

Industry News | 2018-10-18 09:45:34.0

How to Export Gerber Files from Eagle

Flason Electronic Co.,limited


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