EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
Industry News | 2019-10-03 14:09:50.0
BTU International, Inc. will host a Vacuum Reflow Workshop on November 5, 2019, at ACI Technologies in Philadelphia, PA. The one-day workshop will take place from 10 a.m. - 6 p.m. and will feature a live demonstration with X-ray analysis.
Industry News | 2018-10-18 11:15:12.0
PCB Design and Layout Guidelines
Industry News | 2018-10-18 11:21:46.0
Designing a Multilayer PCB Layout
Technical Library | 2013-02-08 22:56:47.0
Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the total void content is minimal. X-ray methods are the predominate method for solder void analysis but this method can be quite subjective for non grid array components due to the two dimensional aspects of X-ray images and software limitations. A novel method of making a copper "sandwich" to simulate under lead and under component environs during reflow has been developed and is discussed in detail. This method has enabled quantitative solder paste void analysis for lead free and specialty paste development and process refinement. Profile and paste storage effects on voiding are discussed. Additionally an optimal design and material selection from a solder void standpoint for a heat spreader on a BCC (Bumpered Chip Carrier) has been developed and is discussed.
Technical Library | 2018-01-17 22:47:02.0
Fine pitch copper (Cu) Pillar bump has been growing adoption in high performance and low-cost flip chip packages. Higher input/output (I/O) density and very fine pitch requirements are driving very small feature sizes such as small bump on a narrow pad or bond-on-lead (BOL) interconnection, while higher performance requirements are driving increased current densities, thus assembling such packages using a standard mass reflow (MR) process and maintaining its performance is a real and serious challenge. (...) In this study a comprehensive finding on the assembly challenges, package design, and reliability data will be published. Originally published in the SMTA International 2016
Industry News | 2020-01-07 11:25:34.0
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020, at the San Diego Convention Center in California. The team will showcase both the PYRAMAX™ Vacuum reflow oven and the AQUA SCRUB flux management in Booth #3119.
Industry News | 2022-04-28 14:22:29.0
BTU International, Inc. today announced plans to exhibit at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg. The company will highlight its Aqua Scrub™ Flux Management Technology and PYRAMAX™ reflow oven in exhibit with BTU's distributor, Stratus Vision, Hall 4A, Stand 411.
Industry News | 2022-05-18 12:53:24.0
BTU International, Inc. is pleased to announce that Bob Bouchard, Director of Sales, will present at the SMTA Michigan Expo & Tech Forum. The presentation entitled, "Vacuum Reflow Thermal Profile Challenges" will take place Tuesday, May 17, 2022 at the Laurel Manor Banquet & Conference Center in Livonia, MI.
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