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Factors Affecting the Adhesion of Thin Film Copper on Polyimide

Technical Library | 2017-11-22 12:38:51.0

The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described[1] an approach to very thin copper laminates of coating uniform layers of nano copper inks and converting them into conductive foils via photonic sintering with a multibulb conveyor system, which is consistent with roll-to-roll manufacturing. The copper thickness of these foils can be augmented by electroplating. Very thin copper layers enable etching fine lines in the flexible circuit. These films must adhere tenaciously to the polyimide substrate.In this paper, we investigate the factors which improve and inhibit adhesion. It was found that the ink composition, photonic sintering conditions, substrate pretreatment, and the inclusion of layers (metal and organic) intermediate between the copper and the polyimide are important.

Intrinsiq Materials Inc.

A Designed Experiment for the Influence of Copper Foils on Impedance, DC Line Resistance and Insertion Loss

Technical Library | 2013-03-28 16:18:22.0

For the last couple of years, the main concerns regarding the electrical performance of blank PCB boards were impedance and ohmic resistance. Just recently, the need to reduce insertion loss came up in discussions with blank board customers (...) The paper describes the test vehicle and the testing methodology and discusses in detail the electrical performance characteristics. The influence of the independent variables on the performance characteristics is presented. Finally the thermal reliability of the boards built applying different copper foils and oxide replacements was investigated.

Multek Inc.

Determination of Copper Foil Surface Roughness from Micro-section Photographs

Technical Library | 2013-04-25 11:42:01.0

Specification and control of surface roughness of copper conductors within printed circuit boards (PCBs) are increasingly desirable in multi-GHz designs as a part of signal-integrity failure analysis on high-speed PCBs. The development of a quality-assurance method to verify the use of foils with specified roughness grade during the PCB manufacturing process is also important... First published in the 2012 IPC APEX EXPO technical conference proceedings.

Cisco Systems, Inc.

Copper Foil Composite Materia

Copper Foil Composite Materia

New Equipment | Other

Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t

WE GOT Electronic Co., Ltd

Signal Transmission Loss due to Copper Surface Roughness in High-Frequency Region

Technical Library | 2015-04-30 20:17:03.0

Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So, signal transmission loss of copper wiring on a printed circuit board has been studied. First, total signal loss was divided into dielectric loss and conductor loss quantitatively based on electromagnetic theory. In particular, the scattering loss due to surface roughness of copper foil has been examined in detail. And the usefulness of the copper foil with low surface roughness has been demonstrated.

Mitsui Kinzoku Group

Insulectro, Oak-Mitsui, CAC Inc Create Landmark Partnership

Industry News | 2015-06-22 13:17:54.0

Insulectro (www.insulectro.com), a leading supplier of materials for use in the PCB and printed electronics industries, announced a breakthrough partnership to supply world-class performance copper foils manufactured by Oak-Mitsui throughout North America.

INSULECTRO

WELLEN PCB CO.LTD

Industry Directory | Manufacturer

Wellen PCB Co.,Ltd is a high technology PCB manufacturer in China Our products include: Multilayer PCB,Metal based PCB,Hi-Tg heavy copper foil PCB,Flat winding multilayer PCB,DHI PCB and so on

Leading Copper Parts Manufacturer - PARENTNashik

Leading Copper Parts Manufacturer - PARENTNashik

Videos

Paramount Enterprises with a renowned brand PARENTNashik is an ISO 9001:2015 certified company, listed in major leading manufacturers, suppliers & exporters of resistance spot welding consumables, spares, weldparts in Nashik – India. PARENTNashik is

Paramount Enterprises

Tachyon®-100G Low-loss Laminate Material For High-speed Digital Applications

Tachyon®-100G Low-loss Laminate Material For High-speed Digital Applications

New Equipment | Materials

Tachyon-100G laminate materials are designed for very high-speed digital applications up to and beyond speeds of 100 Gb/s. Tachyon 100-G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature

Isola Group

Fluorescent based systems

Fluorescent based systems

New Equipment |  

The phasor range of machines uses a different illumination and imaging technique and is designed for use with low contrast materials such as RTF, DSTF or double treated copper foils. phasor systems use the florescent properties of the pcb laminate to

Lloyd Doyle


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