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Easy Braid PCB Hand Soldering / Rework Products

Easy Braid PCB Hand Soldering / Rework Products

New Equipment | Rework & Repair Equipment

Easy Braid’s replacement soldering tips and rework stations provide power, performance, and reliability. The EB9000S, EB5000S, and EB2000S Soldering Rework Stations are based on Curie Heat Technology, a very precise and self-regulating scientific tec

EasyBraid Co.

Effects of Tin Whisker Formation on Nanocrystalline Copper

Technical Library | 2023-02-13 19:23:18.0

Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.

Johns Hopkins Applied Physics Laboratory

Caring Circuit Tech Limited

Industry Directory | Manufacturer

Caring Circuit specialises in the supply of prototype, small and medium-series PCBs factory in Shenzhen,China.We are a leading provider of custom Single layer,double layer,multilayer rigid PCBs.

Adhesion Testing - How to Do it!

Adhesion Testing - How to Do it!

Videos

Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in

ASKbobwillis.com

Nepes Corporation

Industry Directory | Manufacturer

Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.

EB Solder / Rework Stations

EB Solder / Rework Stations

New Equipment | Rework & Repair Equipment

Easy Braid’s replacement soldering tips and rework stations provide power, performance, and reliability. The EB9000S, EB5000S, and EB2000S Soldering Rework Stations are based on Curie Heat Technology, a very precise and self-regulating scientific tec

EasyBraid Co.

IPC-A-600 Acceptability of Printed Boards Training and Certification Program

Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)

The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.

PIEK International Education Centre

Desoldering Braid / Wick

Desoldering Braid / Wick

New Equipment | Rework & Repair Equipment

Desoldering braid (wick) is copper braid used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics. Electronic components are often mounted on a circuit board and careful desoldering of components results i

EasyBraid Co.

Variety Solder Masks Available By The Oz. and Gallon

Variety Solder Masks Available By The Oz. and Gallon

New Equipment | Solder Materials

Ceasolder-PAL (Pink Acrylic Latex) Peelable Acrylic Latex Solder Mask Ceasolder-Pal is a temporary, peelable solder mask comprised of a thixotropic, synthetic acrylic latex designed to withstand fluxing, wave soldering and cleaning operations. Unli

solderstoreonline.com

Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates

Technical Library | 2021-09-08 13:43:56.0

Manganese can be an optimal alloying addition in lead-free SAC (SnAgCu) solder alloys because of its low price and harmless nature. In this research, the mechanical properties of the novel SAC0307 (Sn/Ag0.3/Cu0.7) alloyed with 0.7 wt.% Mn (designated as SAC0307-Mn07) and those of the traditionally used SAC305 (Sn96.5/Ag3/Cu0.5) solder alloys were investigated by analyzing the shear force and Vickers hardness of reflowed solder balls. During the preparation of the reflowed solder balls, different cooling rates were used in the range from 2.7 K/s to 14.7 K/s.

Budapest University of Technology and Economics


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