New Equipment | Cable & Wire Harness Equipment
Clip on pipe NTC thermistor sensor description The steel clip provides a dual function by holding the sensor housing rigidly in place on a straight section of copper tubing while also providing an excellent thermal connection from the copper tube to
New Equipment | Test Equipment
The hand-held PHASCOPE® PMP10 is ideally suited for quality control in the electroplating and printed circuit board (PCB) industries. Because the instrument employs the phase-sensitive eddy current method (ISO 21 968), it allows the measurement of me
EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
Industry News | 2009-04-23 20:39:41.0
NASHVILLE � April 2009 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it has won a remarkable six awards on two continents during the last year.
Technical Library | 2012-04-26 18:52:37.0
First presented at IPC Apex Expo 2012. The reliability, as tested by thermal cycling, of printed wire boards (PWB) are established by three variables; copper quality, material robustness and design. The copper quality was most influential and could be eva
Technical Library | 2021-07-20 20:02:29.0
During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.
Industry News | 2017-09-26 19:24:28.0
BTU International today announced that it will exhibit at Heat Treat, ASM’s Heat Treating Society Conference & Exhibition, scheduled to take place October 24-26, 2017 in Columbus, Ohio. BTU will highlight its controlled atmosphere furnaces in Booth #2524.
Industry News | 2010-10-20 23:29:54.0
Viasystems Group, Inc. and Faraday Technology, Inc. are collaborating on demonstration of the FARADAYIC(R) ElectroCell technology for the manufacture of printed circuit boards (PCBs) with high-density interconnect features and at high plating rates for improved productivity.
Industry News | 2008-03-20 17:19:34.0
OSAKA, JAPAN � March 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry announces that it is contributing a paper, �Properties that are Important in a Lead-free Solder,� to the Technical Conference that is part of the Printed Circuit Expo, APEX and the Designers� Summit scheduled to take place April 1-3, 2008 at the Mandalay Bay Resort & Convention Center, Las Vegas.
Industry News | 2020-10-03 08:51:07.0
BTU International, Inc. is pleased to announce that Fred Dimock, manager of process technology, and Paul Richter, Solar Applications Specialist, will present during SMTA International. The On-Demand Conference & Expo will take place September 28-October 23, 2020. The BTU team will present two papers during the On-Demand Conference.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
