Electronics Forum | Wed Apr 06 21:37:35 EDT 2005 | KEN
Are you saying you have solder balls (as in solder paste balls) at the lead tips (or land tip)? This means your thermal profile is not hot enough. why the sudden cahnge? I will bet the lead frame material was copper and is now alloy 42. sounds like
Electronics Forum | Tue Dec 18 07:49:01 EST 2012 | markhoch
You can also look to remove the silkscreen layer. Components on an assembly of this size can be easily identified with a seperate Assembly Drawing. But I'd also look to incorporate polarity indicators into the copper layers. That way you wouldn't ne
Electronics Forum | Thu Aug 31 14:27:23 EDT 2000 | Travis Slaughter
How to clean a contaminated board would depend on what it�s contaminated by, alcohol may be just the thing. If there is bare copper that has corroded that could be more of a problem, or maybe not if its due to poor tinning by the board house you coul
Electronics Forum | Mon Feb 06 10:02:14 EST 2006 | Yash Sutariya
Sorry. I actually should clarify those slides. Black pad is not associated with tented vias. Also, you can tent vias with soldermask, but this requires the immersion gold process to be completed prior to soldermask. As such, all copper features (
Electronics Forum | Sun Jun 06 13:03:14 EDT 2010 | whitewing
I'm sure you could buy everything you need to make your own stencils in-house for way less than 200K - lasercut or photochemical etch. If you have someone local with a typesetter of photoplotter , photoetch should be really cheap to set up. I've also
Electronics Forum | Sun Apr 05 00:23:53 EDT 2020 | researchmfg
1. To protect the nickel and copper under gold plating from oxidization before soldering. Gold plating can extend the PCB self-life and improve the solderability for 2nd re-flow. 2. Provide a good bonding strength. For Chip on Board process that Gol
Electronics Forum | Mon May 18 20:57:06 EDT 1998 | Earl Moon
.025" pitch so the only problem we run into is too much HASL on the adhesive side causing improper glue dispense. | As Earl keeps saying HASL thickness is hard to impossible to control. I think we need to look hard at OSP's again but then you get in
Electronics Forum | Mon May 18 22:54:04 EDT 1998 | Dave F
.025" pitch so the only problem we run into is too much HASL on the adhesive side causing improper glue dispense. | | As Earl keeps saying HASL thickness is hard to impossible to control. I think we need to look hard at OSP's again but then you get
Electronics Forum | Mon May 18 13:30:15 EDT 1998 | Earl Moon
| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde
Electronics Forum | Fri May 01 08:15:36 EDT 2009 | davef
Scavenging Methods [Improve Solder Scavenging of Large Area-array Sites, SMT, Laurence Harvilchuck, process research engineer, Unovis Solutions, harvilch@unovis-solutions.com] Two common methods exist for scavenging residual solder on the site for s
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