Electronics Forum | Wed Apr 23 08:35:54 EDT 2003 | davef
Over time, copper in the via will form an oxide with oxygen in the air.
Electronics Forum | Mon Oct 27 14:28:19 EDT 2008 | patrickbruneel
Do you refer to the highlight in the picture as a solderball? Looks more like copper to me.
Electronics Forum | Tue Nov 04 12:58:17 EST 2008 | smt123
I have to agree with Patrick here. This image appears to show a board that is NOT HASL as there is what appears to be a copper pad in the upper portion of the image. But then again the arrow tip appears to be white and I woudl expect that to be red s
Electronics Forum | Mon Jun 14 16:49:08 EDT 2004 | Dreamsniper
Can I manually tin them with solder specially the BGA's. Will that improve the solderability? What about corrosion of the copper? will it be prevented with the above process considering that after tinning of solder the solderability became acceptable
Electronics Forum | Wed Apr 23 15:17:11 EDT 2003 | Robert
Let me see if I got this right. The OSP in un-plugged vias will break down after subsequent reflows and washes which can result in oxidation. Question: Is there any paper covering oxidation and reliability on such a condition. We are averaging .0007
Electronics Forum | Mon May 18 13:18:25 EDT 1998 | Chrys
I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and soldera
Electronics Forum | Mon Jun 14 11:44:23 EDT 2004 | Dreamsniper
I have boards with bad HASL application. First they're not even. Second some pad edges have no HASL and still remains bare copper. What's the maximum and minimum HASL thickness required for a good solderability. My boards are about 6 weeks old, I kno
Electronics Forum | Mon Jun 14 14:39:12 EDT 2004 | davef
HASL Thickness: * HADCO DFM manual specifies a nominal thickness of 50-1500uin with an option for 100-1000uin * Merix DFM manual specifies 30-200uin IPC-6012, Class 1, 2, 3 do not spec a HASL thickness at all but only require that full coverage is m
Electronics Forum | Sun Dec 17 22:23:46 EST 2017 | jmelson
Well, I fixed it. I had resisted taking the motor off because of the recalibrations that would be required. But, it got bad enough I had to. Under the microscope, I could see copper dust packed between the commutator segments. I removed that, and
Electronics Forum | Sun Apr 04 00:51:01 EDT 2010 | jmelson
On the Xilinx chips, I am pretty sure these hairs are NOT tin whiskers. The solder in this particular build was SnPb, and pure tin would almost certainly melt at soldering iron temperatures. My theory is that slivers of the lead frame material, lik
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