Industry News | 2008-03-20 17:19:34.0
OSAKA, JAPAN � March 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry announces that it is contributing a paper, �Properties that are Important in a Lead-free Solder,� to the Technical Conference that is part of the Printed Circuit Expo, APEX and the Designers� Summit scheduled to take place April 1-3, 2008 at the Mandalay Bay Resort & Convention Center, Las Vegas.
Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
Industry News | 2019-04-15 18:42:38.0
Murray Percival Company today announced the launch of a spring sale on PACE items including but not limited to: Pace soldering tips in various sizes, desoldering tips, tip sets, the Pace TJ-85 ThermoJet Handpiece Kit, TT-65 ThermoTweez Handpiece with Tool Stand, and Pace Arm-Evac 50 Fume Extractor.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2024-04-08 15:46:36.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2021-11-03 16:49:59.0
Ultrathin bare die chips were soldered using a novel soldering technology. Using homogeneous flash light generated by high-power xenon flash lamp the dummy components and the bare die NFC chips were successfully soldered to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using industry standard Sn-Ag-Cu lead free alloys. Due to the selectivity of light absorption, a limited temperature increase was observed in the PET substrates while the chip and copper tracks were rapidly heated to a temperatures above the solder melting temperature. This allowed to successfully soldered components onto the delicate polyethylene foil substrates using lead-free alloys with liquidus temperatures above 200 °C. It was shown that by preheating components above the decomposition temperature of solder paste flux with a set of short low intensity pulses the processing window could be significantly extended compared to the process with direct illumination of chips with high intensity flash pulse. Furthermore, it was demonstrated that with localized tuning of pulse intensity components having different heat capacity could be simultaneously soldered using a single flash pulse.
Industry News | 2010-09-30 17:36:09.0
Presentation entitled "Thermal Management in End Applications: Dissipating the Heat Away from the Base of LEDs" to address material specifications for Metal Core / Aluminum PCBs for LED Applications.
Industry News | 2008-02-15 15:45:43.0
OSAKA, JAPAN � February 13, 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it showcased its SN100C products with FCT Assembly, one of its US SN100C Global Partners, at the IPC International Conference on Flexible Circuits, that took place February 13, 2008 in Phoenix, Ariz.
Industry News | 2015-09-10 17:02:54.0
Ventec Europe will present a paper entitled 'Making the right decisions at the right time in the PCB design process' at the 2015 SMART Group European Conference & Exhibition. The conference will be held on the 22-23rd September at the National Physical Laboratory (NPL), one of the UK’s leading science and research facilities, located in Teddington, London.
Industry News | 2009-12-07 18:49:39.0
GREELEY, CO — September, 2009 - FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.’s SN100C product line, announces plans to exhibit its popular SN100C® Lead-Free Solder Paste, Bar and Wire and UltraSlic™ FG solder paste stencil in Hall A4 Stand 570 of the upcoming Productronica exhibition. The event is scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
