Industry News | 2019-05-15 17:09:30.0
NEO Tech announces that it will highlight its high-reliability microelectronics solutions and higher level integration experience at the 2019 Space Tech Expo, which is scheduled to take place May 21-22, 2019 at the Pasadena Convention Center in California.
Industry News | 2012-06-25 12:38:27.0
Seika Machinery, Inc. announces a special sale to assist its customers with meeting the IPC 1601 PCB Storage and Handling Guideline
Industry News | 2012-06-28 21:14:17.0
Seika Machinery, Incannounces a special sale to assist its customers with meeting the IPC 1601 PCB Storage and Handling Guideline. Effective June 25-July 27, 2012, Seika Machinery is offering a special discount on McDry MC-1001 and MC-1002 PCB Storage Cabinets.
Industry News | 2021-10-13 13:02:30.0
BTU International, Inc. today announced plans to exhibit during productronica 2021, scheduled to take place Nov. 16-19, 2021 at Neue Messe München in Munich, Germany. The company will showcase its Aqua Scrub™ Flux Management Technology and a PYRAMAX™ 125A with its representative STRATUS VISION Gmbh in Hall A3, Stand 441.
Industry News | 2016-04-26 11:11:11.0
Gen3 Systems Limited, a specialist British manufacturer and distributor, sees a significant increase in demand for its redesigned line of Surface Insulation Resistance Testers (AutoSIR) and Conductive Anodic Filament Monitoring Testing System (AutoCAF).
Industry News | 2023-06-13 18:20:29.0
ZESTRON is pleased to announce an upcoming webinar on "Enhancing Performance of Copper Pillar Interconnects through Defluxing". The webinar will take place on June 15, 2023, at 2:00 PM EST and will be presented by Ravi Parthasarathy, Senior Application Engineer at ZESTRON Americas.
Technical Library | 2010-07-08 19:49:59.0
Aging characteristics of new lead free solder alloys are in question by many experts because of higher amount of tin’s effect on the diffusion of other metals, primarily copper, to create undesirable boundary intermetallics over long periods of time and even moderately elevated temperatures. A primary layer of intermetallics, Cu6Sn5 forms as the liquid solder makes contact with the solid copper substrate. This reaction however ceases as the solder temperature falls below that of liquidus. A secondary intermetallic Cu3Sn1, an undesirable weak and brittle layer, is thought to form over time and may be accelerated by even mildly elevated temperatures in electronic modules such as laptops under power. This project was designed to quantify the growth rate of Cu3Sn1 over an extended period of time in a thermal environment similar to a laptop in the power on mode.
Industry News | 2008-01-31 00:10:18.0
GREELEY, CO � January 29, 2008 � FCT Solder, a division of FCT Assembly, and Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., announce that it will exhibit SN100C� Lead-Free products paste in booth 213 at the upcoming IPC International Conference on Flexible Circuits, scheduled to take place February 12-14, 2008 in Phoenix, Ariz.
Technical Library | 2019-02-13 13:45:11.0
Development of information and telecommunications network is outstanding in recent years, and it is required for the related equipment such as communication base stations, servers and routers, to process huge amount of data in no time. As an electrical signal becomes faster and faster, how to prevent signal delay by transmission loss is a big issue for Printed Circuit Boards (PCB) loaded on such equipments. There are two main factors as the cause of transmission loss; dielectric loss and conductor loss. To decrease the dielectric loss, materials having low dielectric constant and low loss tangent have been developed. On the other hand, reducing the surface roughness of the copper foil itself to be used or minimizing the surface roughness by modifying surface treatment process of the conductor patterns before lamination is considered to be effective in order to decrease the conductor loss. However, there is a possibility that reduction in the surface roughness of the conductor patterns will lead to the decrease in adhesion of conductor patterns to dielectric resin and result in the deterioration of reliability of PCB itself. In this paper, we will show the evaluation results of adhesion performance and electrical properties using certain type of dielectric material for high frequency PCB, several types of copper foil and several surface treatment processes of the conductor patterns. Moreover, we will indicate a technique from the aspect of surface treatment process in order to ensure reliability and, at the same time, to prevent signal delay at the signal frequency over 20 GHz.
Technical Library | 2018-05-17 11:14:52.0
Intermetallic compound (IMC) growth is being studied in earnest in this past decade because of its significant effect the solder joint reliability. It appears that from numerous investigations conducted, excessive growth of IMC could lead to solder joint failure. Leading to this, many attempts has been made to determine the actual IMC thickness. However, precise and true representation of the growth in the actual 3D phenomenon from 2D cross-section investigations has remained unclear. This paper will focus on the measuring the IMC thickness using 3D surface profilometer (Alicona Focus G4). Lead free solder, Sn3.0Ag0.5Cu (SAC305) was soldered onto copper printed circuit board (Cu PCB). The samples were then subjected to thermal cycle (TC) storage process with temperature range from 0 °C to 100 °C for 200 cycles and up to 1000 cycles were completed.
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2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
