Full Site - : copper residue (Page 12 of 23)

The Balver Zinn Group Goes with LLE Soluciones to Guadalajara for the SMTA Mexico Expo & Tech Forum

Industry News | 2016-09-19 19:58:07.0

The Balver Zinn Group announces that they will exhibit together with LLE Soluciones at the SMTA Mexico Expo & tech Forum on booth #17. The SMTA Expo is scheduled to take place October 5-6, 2016 at the Riu Hotel in Guadalajara, Mexico. Representatives from LLE and Balver Zinn will display the company’s OT2M solder paste, Brilliant B2012 solder wire, SN100C® alloy along with the latest flux technology.

Balver Zinn

The Balver Zinn Group Goes with LLE Soluciones & Repstronics to Guadalajara for the SMTA Mexico Expo & Tech Forum

Industry News | 2017-10-06 09:35:20.0

The Balver Zinn Group a leading global manufacturer of solder materials, announces that they will exhibit together with LLE Soluciones & Repstronics at the SMTA Mexico Expo & tech Forum. The SMTA Mexico Expo is scheduled to take place October 18-19, 2017 at the hotel Riu Plaza in Guadalajara, Mexico.

Balver Zinn

Nihon Superior to Introduce New SN100CV Solder Alloy at APEX

Industry News | 2018-01-28 16:15:48.0

Nihon Superior will exhibit in Booth #1019 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in California. The company will introduce the new SN100CVTM P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.

Nihon Superior Co., Ltd.

Nihon Superior to Exhibit the New SN100CV Solder Alloy at NEPCON China

Industry News | 2018-04-03 08:04:48.0

Nihon Superior will exhibit in Stand 2L31 at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase the new SN100CVTM P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.

Nihon Superior Co., Ltd.

Nihon Superior to Exhibit New SN100CV Solder Alloy at NEPCON South China

Industry News | 2018-07-24 06:27:57.0

Nihon Superior scheduled to take place Aug. 28-30, 2018 at the Shenzen Convention & Exhibition Center. The company will debut the new SN100CV™ P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.

Nihon Superior Co., Ltd.

New SN100CV solder paste from Nihon Superior at SMTAI reduces voiding

Industry News | 2018-09-18 20:11:02.0

Nihon Superior Co.today announced plans to exhibit in Booth #511 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will showcase the new SN100CVTM P608 D4 solder paste, NS-F851 rosin-based flux, ALUSAC-35 alloy and Alconano Nano-Silver paste.

Nihon Superior Co., Ltd.

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:32:52.0

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Indium Corporation to Showcase High-Reliability Materials for Power Electronics at APEC

Industry News | 2024-02-19 12:00:05.0

Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicle manufacturing, at APEC 2024, February 25‒29 in Long Beach, California.

Indium Corporation

Henkel Extends Die Attach Solder Paste Product Line, Adds Printable Formula to Popular Portfolio

Industry News | 2009-11-19 14:48:22.0

Broadening its well-known Multicore die attach solder portfolio, which already includes Multicore DA100 solder paste for high-lead and lead-free applications, Henkel today announced the launch of Multicore DA101. This newest formulation delivers many of the well-known benefits of Multicore DA100, but has been designed for screen print operations, thus offering flexibility for varying process requirements.

Henkel Electronic Materials

Nihon Superior to Showcase the Newest Addition to the SN100C Lead-Free Solder Series at the 2012 IPC APEX Expo

Industry News | 2012-01-21 16:28:10.0

Nihon Superior will introduce the newest addition to its SN100C lead-free solder series in Booth #3044 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.

Nihon Superior Co., Ltd.


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