High Speed full-auto screen printing machine SMT Automatic Visible PCB Screen Printer For PCB Product Line. ASCEN PCB solder paste printer Support glue printing, automatic control improves production efficiency, quality control and saves pr
solder paste printing is a critical step in the SMT PCB production, Since the solder paste is used to directly form the soldering joint, the quality of solder paste printing affects the performance and reliability of the surface mount assembly,high q
PCB depaneling machine use for the electronic factory that cover the PCBA manufacturing,LED lighting,electronic product assembly. ASC-620 cutting equipment can use for cutting LED long board and also can use to the high component PCBA separ
ASCEN PCB depaneling machine can separation the PCB board with high component placed close to the edge can be separated safety. 620 model PCB depanelizer application cover the PCBA manufacturing,LED lighting,electronic product assembly
ASCEN 620 model PCB separator& pneumatic type separator, we use the most advanced non-stress idea to designed it, it’s help to prevent the chap phenomena as the PCB separated by the general separator, Unlike double round blade PCB separator
Automatic Glue Dispenser DMD221 Features ▶Humanized design, hand-held teaching box operation, convenient programming, easy to learn. ▶It has the functions of drawing points, lines, surfaces, arcs and various irregular curves continuously and uninter
Automatic Glue Dispenser DMD221 Features ▶Humanized design, hand-held teaching box operation, convenient programming, easy to learn. ▶It has the functions of drawing points, lines, surfaces, arcs and various irregular curves continuously and uninter
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
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