Industry Directory | Manufacturer
Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.
Industry Directory | Manufacturer
As trends towards the miniaturization and increased functional integration of electronics, the demands on quality assurance are rising. FISCHER has many coating thickness measurement solutions for the electronics sector.
New Equipment | Fabrication Services
Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
Electronics Forum | Tue Nov 08 05:00:23 EST 2005 | rlackey
Hi CW, Regarding orientation, yes, your diagram is right - see the following link for confirmation. http://search.murata.co.jp/Ceramy/image/img/A18X/C2EB3C.PDF Regarding information on bending strength you want to talk to your local Murata office
Electronics Forum | Thu Oct 02 11:04:48 EDT 2003 | russ
Out of curiousity, Isn't soldermask only used as a solder processing aid and to cover the copper? Russ
Used SMT Equipment | AOI / Automated Optical Inspection
Saki BF-Frontier AOI System Model BF-Frontier Vintage: 12/2006 Board Thickness: 0.6 - 2.5mm, 24 - 100mils Board Warp: +/-2mm, 79mils PCB Clearance; Top: 40mm, 1.57in Bottom: 40mm, 1.57in Inspection Categories: Presence/Absence, Misalignment, Tomb sto
Used SMT Equipment | AOI / Automated Optical Inspection
Saki BF-Frontier AOI System Model BF-Frontier Vintage: 12/2006 Board Thickness: 0.6 - 2.5mm, 24 - 100mils Board Warp: +/-2mm, 79mils PCB Clearance; Top: 40mm, 1.57in Bottom: 40mm, 1.57in Inspection Categories: Presence/Absence, Misalignment, Tomb sto
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2018-10-18 07:56:58.0
Wave soldering process defectives and handling solution
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Material 2). 2 layer, 1.2mm thick 3). 5 oz copper weight. 4). LPI Green solder mask/White silk screen 5). Immersion gold over nickle
Technical Library | 2012-10-23 14:25:38.0
Tin-Silver-Copper alloys are the primary choice for lead-free SMT assembly. Although there are other options available such as alloys containing bismuth or indium and other elements, tin-silver-copper solders, also known as SAC alloys are by far the most popular. They are used by approximately 65% of users, as last surveyed by Soldertec in 2003.
Technical Library | 2017-06-13 17:14:59.0
For tin-rich solder alloys, 200 C (392 F) is an extreme temperature. Intermetallic growth in tin-copper systems is known to occur and is believed to bear a direct relationship to failure mechanisms. This study of morphological changes with time at elevated temperatures was made to determine growth rates of tin-copper intermetallics. Preferred growth directions, rates of thickening, and notable changes in morphology were observed.Each of four tin-base alloys was flowed on copper and exposed to temperatures between 100 C and 200 C for time periods of up to 32 days. Metallographic sections were taken and the intermetallics were examined. Intermetallic layer thickening is characterized by several distinct stages. The initial growth of side plates is extremely rapid and exaggerated. This is followed by retrogression (spheroidization) of the elongated peaks and by general thick-
Guillotine type V-cut PCB Cutting Machine Product Description 1. For internal strength generates during separation, Minimize it to value under 180uE ,to avoid solder crack or component damage 2. Able to separate edge of V-slot, minimum distance to
Electrovert's DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave.
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Wed Jul 03 00:00:00 EDT 2024 - Wed Jul 03 00:00:00 EDT 2024 | ,
Europe Chapter Webinar: "Back-to-Basics" SMT Assembly
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
Career Center | Alleppey, Kerala India | Engineering,Production,Quality Control
Good knowledge about the operations of various PCB surface mounting machines Good communication skills
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-36-wave-soldering-insufficient-fill-and-voids-in-pth
. Board thickness, finished hole size, board plating material, flux type and application method and type of solder all affect this possible defect
Blackfox Training Institute, LLC | https://www.blackfox.com/soldering/4-common-errors-in-smt-assembly/
Español Blackfox Courses Instructor Soldering Series Component Series Mechanical Assembly Series Operator Component Series Customizable Soldering Comprehensive Soldering Printed Circuit Board Repair ESD
