New Equipment | Solder Materials
KappAloy15™ - 85%Sn - 15%Zn – has a wider plastic range of 390°F - 500°F (199°C - 260°C). This makes it ideal for hand soldering Aluminum plates and parts, allowing manipulation of the parts as the solder cools. KappAloy™ Tin-Zinc solder is designe
New Equipment | Solder Materials
KappRad has been developed specifically to join and repair Aluminum and Aluminum Copper radiators and heat exchangers. A lower melting point makes delicate repair work easier. Matching KAPP Golden Flux acts as a temperature guide to ensure simple app
New Equipment | Solder Materials
KappaTinning Compound is a dry mixture of pure powdered Tin and flux specifically designed for pre-tinning cast Iron, Steel, Bronze and Copper bearing shells. A one pound container of KappaTinning Compound contains about twice as much Tin and goes fu
New Equipment | Solder Materials
Kapp Golden Flux™ has been designed specifically for soldering Aluminum to Aluminum, Copper, and Stainless Steel. Kapp Golden Flux™ is a golden colored, Chloride-Free, organic-based flux containing 56-60% active ingredients. It is a liquid consisting
Industry News | 2003-05-21 09:17:38.0
Enters into Licensing and Joint Development Alliance with ATMI
New Equipment | Solder Materials
The KappZapp4 - 4% Silver formula is often preferred for hand soldering Stainless and Copper parts. It has a wider slushy or plastic range to allow users to manipulate parts during cooling. Low melting temperatures prevent loss of properties and mi
New Equipment | Cable & Wire Harness Equipment
KS Terminals founded in 1973, produces insulated and non-insulated copper terminals, insulated quick disconnectors, din terminals, cord end terminals, water proof heat shrinkable terminals with adhesive tubing, butt splice and other connectors, stain
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Industry News | 2007-10-18 15:35:51.0
Cableco Technologies Corporation, a business unit of Methode Electronics, Inc., announces the launch of an e-commerce, on-line store for customers to purchase the company's highly flexible, 1000 Volt, UL approved PowerFlex 1000(TM) cable. The new e-commerce store site, www.store.cablecotech.com, offers a wide range of wire gauges from 10 AWG to 4/0 AWG PowerFlex 1000 cable that can be purchased with credit cards (MC, VISA, AE). All products will ship within 72 hours of order placement.
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
